Table of Contents
Contents
Page
Data Addendum
May 2001
DSP16410C Digital Signal Processor
Agere Systems Inc.
2
1
2
3
4
5
Introduction ................................................................................................................................................ 1
Features..................................................................................................................................................... 1
Device Identification................................................................................................................................... 1
Notation Conventions................................................................................................................................. 6
Ball Grid Array Information......................................................................................................................... 7
5.1
208-Ball PBGA Package .................................................................................................................. 7
5.2
256-Ball EBGA Package ................................................................................................................ 10
Device Characteristics ............................................................................................................................. 13
6.1
Absolute Maximum Ratings............................................................................................................ 13
6.2
Handling Precautions ..................................................................................................................... 13
6.3
Recommended Operating Conditions ............................................................................................ 14
6.3.1 Package Thermal Considerations .......................................................................................... 14
Electrical Characteristics and Requirements ........................................................................................... 15
7.1
Maintenance of Valid Logic Levels for Bidirectional Signals and Unused Inputs........................... 17
7.2
Analog Power Supply Decoupling.................................................................................................. 18
7.3
Power Dissipation........................................................................................................................... 19
7.3.1 Internal Power Dissipation...................................................................................................... 19
7.3.2 I/O Power Dissipation............................................................................................................. 20
7.4
Power Supply Sequencing Issues.................................................................................................. 21
7.4.1 Supply Sequencing Recommendations ................................................................................. 21
7.4.2 External Power Sequence Protection Circuits........................................................................ 23
Timing Characteristics and Requirements............................................................................................... 24
8.1
Phase-Lock Loop ........................................................................................................................... 25
8.2
Wake-Up Latency........................................................................................................................... 25
8.3
DSP Clock Generation ................................................................................................................... 26
8.4
Reset Circuit................................................................................................................................... 27
8.5
Reset Synchronization.................................................................................................................... 28
8.6
JTAG .............................................................................................................................................. 29
8.7
Interrupt and Trap........................................................................................................................... 30
8.8
Bit I/O ............................................................................................................................................. 31
8.9
System and External Memory Interface ......................................................................................... 32
8.9.1 Asynchronous Interface.......................................................................................................... 33
8.9.2 Synchronous Interface ........................................................................................................... 36
8.9.3 ERDY Interface ...................................................................................................................... 38
8.10 PIU ................................................................................................................................................. 39
8.11 SIU ................................................................................................................................................. 43
Package Diagrams................................................................................................................................... 53
9.1
208-Pin PBGA................................................................................................................................ 53
9.2
256-Pin EBGA................................................................................................................................ 54
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