
STD130
V
MSUNG
S
ELECTRONICS
3
Samsung ASIC
I/Os and I/O IPs
1.8V, 2.5V and 3.3V drive I/Os, 3.3V and 5V
tolerant I/Os
3-level(high, medium, no) slew rate control
Minimum wire bonded pad pitch
- single in line(70um) I/Os
- staggered(35/70um) I/Os
Driving capability
- 1,2,4,8,12,16,20,24mA(for drive I/Os)
- 1,2,4,6mA (for tolerant I/Os)
I/O IPs
*
In-house tools
Name
Description
Frequency(MHz)
PCI
2.1 compliant, 5V tolerant
33, 66
USB
1.1 compliant, Full speed/
Low speed
12/1.5
SSTL2
Class-I and II, SDRAM
Interface
Up to 200
ATA
ATA4/UDMA66, 3.3/5V
tolerant
AGP
AGP2.0 compliant
66@1X,133@2X,
266@4X
PECL
ATM interface
200(single)
500(differential)
HSTL
1.5V, SRAM interface,
programmable output
impedance control
300
Hot
Swap
PCI
1V pre-charge, VIO pre-
charge
33, 66
PCI-X
1.0 compliant, 3.3V
133
Parameter
Rating
Unit
V
DD
DC supply
voltage
1.8V I/O
1.65 to 1.95
V
2.5V I/O
2.3 to 2.7
3.3V I/O
3.0 to 3.6
3.3V tolerant I/O
1.65 to 1.95
5V tolerant I/O
3.0 to 3.6
Analog Core
DC supply
voltage
3.3V core
3.3V
±
5%
2.5V
±
5%
1.8V
±
5%
2.5V core
1.8V core
T
A
Commercial temperature range
0 to 70
°
C
Industrial temperature range
* If you want this range, please
contact field application engi-
neer in Samsung.
– 40 to 85
Recommended Operating Conditions
Design Flow
Design Kits
Logic
Synthesis
Synopsys Design Compiler,
Synopsys Physical Compiler
Cadence Verilog-XL, Cadence NC-Verilog,
Viewlogic ViewSim, Mentor ModelSim-
VHDL, Mentor ModelSim-Verilog,
Synopsys VSS, Synopsys VCS
Synopsys TestGen, Synopsys TestCom-
piler, Synopsys TetraMax, Mentor Fastscan
Logic
Simulation
ScanInsertion
and ATPG
Static Timing
Analysis
RC Analysis
Power
Analysis
Formal
Verification
Fault
Simulation
Delay
Calculator
Synopsys PrimeTime
Avant! Star-RC
Synopsys DesignPower, CubicPower*
Synopsys Formality, Chrysalis Design
VERIFYer, Verplex Tuxedo-LEC
Cadence Verifault
CubicDelay*
Floorplanner
Avant! PlanetPL, Cadence DesignPlanner,
CubicPlan*
Avant! Apollo, Cadence Silicon Ensemble
Dracula, Hercules, Calibre
P&R
DRC and LVS
Package Type
# of Pins
QFP
Thin QFP
Power QFP
Plastic Leaded
Chip Carrier
256,208,176,160,144,128,100,80,64,48
100,80
304,240,208,160,144,128,120,100
84,68,52,44,32,28,18
Plastic BGA
560,492,388,352,329,316,313,304,300,
292,272,256,225,208,196,153,119
696,648,540,352,304,256
280,256,208,196,180,160,153,144,119,
64,48
Super BGA
Flat BGA
Multi Chip
Package
256,100,69,68,64,48,32
ASIC Design Kit and EDA support
Package Availability