
PM5317 SPECTRA-9953 Telecom Standard Product Data Sheet
Release
Proprietary and Confidential to PMC-Sierra, Inc., and for its customers’ internal use.
Document No.: PMC-2000741, Issue 5
541
24 Ordering and Thermal Information
Table 40 Ordering Information
PART NO.
Description
PM5317-FI
1152 FCBGA
This product is designed to operate over a wide temperature range when used with a heat sink
and is suited for outside plant equipment
1
.
Table 41 Outside Plant Thermal Information
Maximum long-term operating junction temperature (T
J
) to ensure adequate
long-term life.
105
0
C
Maximum junction temperature (T
J
) for short-term excursions with
guaranteed continued functional performance
.
This condition will typically be reached when the local ambient temperature
reaches 85 °C.
125
0
C
Minimum ambient temperature (T
A
)
-40
0
C
Table 42 Device Compact Model
3
Junction-to-Case Thermal
Resistance,
JC
Junction-to-Board Thermal
Resistance,
JB
0.16 °C/W
3.95 °C/W
Table 43 Heat Sink Requirements
SA
+
CS
4
The sum of
SA
+
CS
must be less
than or equal to:
[(105 - T
A
) / P
D
] -
JC
] °C/W
where:
T
A
is the ambient temperature at the
heat sink location
P
D
is the operating power dissipated in
the package
SA
and
CS
are required for long-term
operation
Power depends upon the operating mode. To obtain power information, refer to ‘High’ power
values in section 18.1 Power Requirements.Notes
1. The minimum ambient temperature requirement for Outside Plant Equipment meets the minimum
ambient temperature requirement for Industrial Equipment.
2. Short-term is used as defined in Telcordia Technologies Generic Requirements GR-63-Core Core.
3.
JC
, the junction-to-case thermal resistance, is a measured nominal value plus two sigma.
JB
, the
junction-to-board thermal resistance, is obtained by simulating conditions described in JEDEC
Standard JESD 51-8.