參數(shù)資料
型號: intel386 DX
廠商: Intel Corp.
英文描述: 32-Bit CHMOS Microprocessor With Integrated Memory Management(32位CHMOS 微處理器帶集成存儲管理)
中文描述: 32位CHMOS微處理器集成內(nèi)存管理(32位CHMOS微處理器帶集成存儲管理)
文件頁數(shù): 122/139頁
文件大?。?/td> 1587K
代理商: INTEL386 DX
Intel386
TM
DX MICROPROCESSOR
8.3 PACKAGE THERMAL
SPECIFICATION
The Intel386 DX is specified for operation when
case temperature is within the range of 0
§
C–85
§
C.
The case temperature may be measured in any envi-
ronment, to determine whether the Intel386 DX is
within specified operating range.
The PGA case temperature should be measured at
the center of the top surface opposite the pins, as in
Figure 8.2.
231630–36
Figure 8.2. Measuring Intel386
TM
DX PGA Case Temperature
Table 8.2. Intel386
TM
DX PGA Package Thermal Characteristics
Thermal Resistance D
§
C/Watt
Airflow D ft./min (m/sec)
Parameter
0
50
100
(0.50)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
(0)
(0.25)
i
Junction-to-Case
(case measured
as Fig. 8-2)
2
2
2
2
2
2
2
i
Case-to-Ambient
(no heatsink)
19
18
17
15
12
10
9
i
Case-to-Ambient
(with omnidirectional
heatsink)
16
15
14
12
9
7
6
i
Case-to-Ambient
(with unidirectional
heatsink)
15
14
13
11
8
6
5
NOTES:
1. Table 8.2 applies to Intel386
TM
DX PGA
plugged into socket or soldered directly
into board.
2.
i
JA
e
i
JC
a
i
CA
.
3.
i
J-CAP
e
4
§
C/w (approx.)
i
J-PIN
e
4
§
C/w (inner pins) (approx.)
i
J-PIN
e
8
§
C/w (outer pins) (approx.)
4. T
A
e
T
C
b
P
*
i
CA
(ambient temperature)
231630–72
122
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