參數(shù)資料
型號： DS3112N
廠商： DALLAS SEMICONDUCTOR
元件分類： Digital Transmission Controller
英文描述： DATACOM, FRAMER, PBGA256
封裝： 27 X 27 MM, PLASTIC, BGA-256
文件頁數(shù)： 88/134頁
文件大小： 900K
代理商： DS3112N
DS3112
57 of 134
T3 Alarm Criteria Table 5.3A
Alarm/
Condition
Definition
Set Criteria
Clear Criteria
AIS
Alarm Indication Signal
Properly framed 1010...
pattern which is aligned
with the 1 just after each
overhead bit and all C Bits
are set to zero
In each 84 bit information
field, the properly aligned
10... pattern is detected with
less than 4 bit errors (out of
84 possible) for 1024
consecutive information bit
fields (1.95ms) and all C
Bits are majority decoded to
be zero during this time
In each 84 bit information
field, the properly aligned
10... pattern is detected
with 4 or more bit errors
(out of 84 possible) for
1024 consecutive
information bit fields
(1.95ms)
LOS
Loss Of Signal
192 consecutive zeros
No EXZ events over a 192
bit window that starts with
the first one received
LOF
Loss Of Frame
Too many F Bits or M Bits
in error
3 or more F bits in error out
of 16 consecutive or 2 or
more M bits in error out of
4 consecutive
Synchronization occurs
RAI
(note: RAI
can also be
indicated via
FEAC codes
in the C-Bit
Parity Mode)
Remote Alarm Indication
(this is also referred to as
SEF/AIS in Bellcore GR-
820)
X1 = X2 = 0 (active)
X1 = X2 = 1 (inactive)
X1 and X2 = 0 for 4
consecutive M frames
(426us)
X1 and X2 = 1 for 4
consecutive M frames
(426us)
Idle Signal
Properly framed 1100...
pattern which is aligned
with the 11 just after each
overhead bit and the C Bits
in Subframe 3 are zero
In each 84 bit information
field, the properly aligned
1100... pattern is detected
with less than 4 bit errors
(out of 84 possible) for
1024 consecutive
information bit fields
(1.95 ms) and the C Bits in
Subframe 3 are majority
decoded to be zero during
this time
In each 84 bit information
field, the properly aligned
1100... pattern is detected
with 4 or more bit errors
(out of 84 possible) for
1024 consecutive
information bit fields
(1.95 ms)
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS3112N+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112N+W 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112NC1 制造商:Maxim Integrated Products 功能描述:T3 E3 MULTIPLEXER, 3.3V T3/E3 FRAMER AND M13/E13/G.747 MUX - Rail/Tube
DS3112ND1E 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
DS3112RD 功能描述:網(wǎng)絡(luò)控制器與處理器 IC RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
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