參數(shù)資料
型號： DS3112N
廠商： DALLAS SEMICONDUCTOR
元件分類： Digital Transmission Controller
英文描述： DATACOM, FRAMER, PBGA256
封裝： 27 X 27 MM, PLASTIC, BGA-256
文件頁數(shù)： 13/134頁
文件大?。?/td> 900K
代理商： DS3112N
DS3112
11 of 134
SECTION 2: SIGNAL DESCRIPTION
2.1 OVERVIEW / SIGNAL LEAD LIST
This section describes the input and output signals on the DS3112. Signal names follow a convention
that is shown in Table 2.1A. Table 2.1B lists all of the signals, their signal type, description, and lead
location. Symbols appended with an asterisks (*) are active low signals. The absence of an asterisks
implies an active high signal.
SIGNAL NAMING CONVENTION Table 2.1A
First Letters
Signal Category
Section
C
CPU / Host Control Access Port
2.2
FR
T3 / E3 Receive Framer
2.3
FT
T3 / E3 Transmit Formatter
2.4
LR
Low Speed (T1 or E1) Receive Port
2.5
LT
Low Speed (T1 or E1) Transmit Port
2.6
HR
High Speed (T3 or E3) Receive Port
2.7
HT
High Speed (T3 or E3) Transmit Port
2.8
J
JTAG Test Port
2.9
SIGNAL DESCRIPTION / LEAD LIST (preliminary lead assignment) Table 2.1B
Lead
Symbol
Type
Signal Description
C7
CALE
I
CPU Bus Address Latch Enable.
H3
CA0
I
CPU Bus Address Bit 0. LSB.
H2
CA1
I
CPU Bus Address Bit 1.
H1
CA2
I
CPU Bus Address Bit 2.
J4
CA3
I
CPU Bus Address Bit 3.
J3
CA4
I
CPU Bus Address Bit 4.
J2
CA5
I
CPU Bus Address Bit 5.
J1
CA6
I
CPU Bus Address Bit 6.
K2
CA7
I
CPU Bus Address Bit 7. MSB.
C4
CCS*
I
CPU Bus Chip Select.
C2
CD0
I/O
CPU Bus Data Bit 0. LSB.
D2
CD1
I/O
CPU Bus Data Bit 1.
D3
CD2
I/O
CPU Bus Data Bit 2.
E4
CD3
I/O
CPU Bus Data Bit 3.
C1
CD4
I/O
CPU Bus Data Bit 4.
D1
CD5
I/O
CPU Bus Data Bit 5.
E3
CD6
I/O
CPU Bus Data Bit 6.
E2
CD7
I/O
CPU Bus Data Bit 7.
E1
CD8
I/O
CPU Bus Data Bit 8.
F3
CD9
I/O
CPU Bus Data Bit 9.
G4
CD10
I/O
CPU Bus Data Bit 10.
F2
CD11
I/O
CPU Bus Data Bit 11.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS3112N+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112N+W 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112NC1 制造商:Maxim Integrated Products 功能描述:T3 E3 MULTIPLEXER, 3.3V T3/E3 FRAMER AND M13/E13/G.747 MUX - Rail/Tube
DS3112ND1E 制造商:Rochester Electronics LLC 功能描述: 制造商:Maxim Integrated Products 功能描述:
DS3112RD 功能描述:網(wǎng)絡(luò)控制器與處理器 IC RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
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