參數(shù)資料
型號： AD6652XBC
廠商： ANALOG DEVICES INC
元件分類： 通信及網(wǎng)絡(luò)
英文描述： SPECIALTY TELECOM CIRCUIT, PBGA256
封裝： 17 X 17 MM, MINI, BGA-256
文件頁數(shù)： 72/76頁
文件大?。?/td> 1802K
代理商： AD6652XBC
AD6652
Preliminary Technical Data
Rev. PrC | Page 74 of 76
OUTLINE DIMENSIONS
1.00
BSC
A
B
C
D
E
F
G
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
H
J
K
L
M
N
P
R
BOTTOM VIEW
15.00 BSC
SQ
A1 CORNER
INDEX AREA
16
T
SEATING
PLANE
0.20 MAX
COPLANARIT
DETAIL A
0.70
0.60
0.50
BALL DIAMETER
0.50
0.30
17.00
BSC SQ
TOP VIEW
BALL A1
INDICATOR
DETAIL A
1.85*
1.71
1.40
COMPLIANT TO JEDEC STANDARDS MO-192-AAF-1
EXCEPT FOR (*) DIMENSIONS
1.31*
1.21
1.10
Figure 57. 256-Lead Chip Scale Ball Grid Array [CSPBGA]
(BC-256-2)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature Range
Package Description
Package Option
Model
AD6652XBC1
40°C to +85°C (ambient)
256-Lead BGA (Ball Grid Array)
BC-256-2
AD6652BBC
40°C to +85°C (ambient)
256-Lead BGA (Ball Grid Array)
BC-256-2
AD6652BC/PCB
+25°C (ambient)
Evaluation Board with AD6652 and Software
1 X-grade material is preproduction material, normally shipped during product characterization and qualification.
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