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參數(shù)資料
| 型號： | AD6652XBC |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, PBGA256 |
| 封裝： | 17 X 17 MM, MINI, BGA-256 |
| 文件頁數(shù)： | 2/76頁 |
| 文件大?。?/td> | 1802K |
| 代理商： | AD6652XBC |
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AD6652
Preliminary Technical Data
Rev. PrC | Page 10 of 76
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter
Rating
ELECTRICAL
AVDD Voltage
0.3 V to +3.9 V
VDD Voltage
0.3 V to +2.75 V
VDDIO Voltage
0.3 V to +3.9 V
AGND, DGND
0.3 V to +0.3 V
ADC VINA, VINB Analog Input
Voltage
0.3 V to AVDD + 0.3 V
ADC Digital Input Voltage
0.3 V to AVDD + 0.3 V
ADC OTRA, OTRB Digital Output
Voltage
0.3 V to VDDIO + 0.3 V
ADC VREF, REFA, REFB Input
Voltage
0.3 V to AVDD + 0.3 V
DDC Digital Input Voltage
0.3 V to VDDIO + 0.3 V
DDC Digital Output Voltage
0.3 V to VDDIO + 0.3 V
ENVIRONMENTAL
Operating Temperature Range
(Ambient)
40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
65°C to +150°C
Stresses above those listed under the Absolute Maximum
Ratings may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
256 BGA, 17 mm sq.
θJA= 23°C /W, still air.
Estimate based on JEDEC JC51-2 model using horizontally
positioned 4-layer board.
TEST LEVEL
I. 100% production tested.
II. 100% production tested at 25°C, and sample tested at
specified temperatures.
III. Sample tested only.
IV. Parameter guaranteed by design and analysis.
V. Parameter is typical value only.
VI. 100% production tested at 25°C, and sample tested at
temperature extremes.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
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