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’
Internal Use
Document ID: PMC-2010146, Issue 4
164
PM2329 ClassiPI Network Classification Processor Datasheet
Table 44
Thermal Characteristics
Item
1
Parameter
Junction to Ambient
Thermal Resistance
(Theta Ja)
Symbol
θ
JA
Conditions
a
Natural Convection
Airflow = 1 m/s (200 LFPM)
Airflow = 2 m/s (400 LFPM)
a.
Specified parameter values vary depending on the given device operation conditions.
b.
The shown maximum operating power dissipation is based on simulated data.
c.
The maximum long-term operating junction temperature is to ensure adequate long-term life. The absolute maximum
junction temperature of 125
°
C is for short-term excursions with guaranteed continued functional performance. Short-term
is understood as the definition stated in Bellcore Generic Requirements GR-63-Core.
Value
12.50
10.00
7.80
Unit
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
°
C/W
SCLK = 100MHz,
ACLK = 200MHz,
V
DD
= 3.3V+5%,
CV
DD
= 1.5V+4%
SCLK = 116MHz,
ACLK = 232MHz,
V
DD
= 3.3V+5%,
CV
DD
= 1.6V+4%
Natural Convection
Airflow = 1 m/s (200 LFPM)
Airflow = 2 m/s (400 LFPM)
12.20
9.50
7.70
2
Junction to Top Thermal
Resistance (Theta Jt)
Junction to Bottom
Thermal Resistance
(Theta Jb)
θ
JT
0.43
3
θ
JB
SCLK = 100MHz,
ACLK = 200MHz,
V
DD
= 3.3V+5%,
CV
DD
= 1.5V+4%
SCLK = 116MHz,
ACLK = 232MHz,
V
DD
= 3.3V+5%,
CV
DD
= 1.6V+4%
SCLK = 100MHz,
ACLK = 200MHz,
V
DD
= 3.3V+5%,
CV
DD
= 1.5V+4%
SCLK = 116MHz,
ACLK = 232MHz,
V
DD
= 3.3V+5%,
CV
DD
= 1.6V+4%
(see Note
c
)
9.00
°
C/W
7.20
°
C/W
4
Maximum Operating
Power Dissipation
P
op-max
SD, EDD load = 15pF
EMA, ECD load = 20pF
(see Note
b
)
4.0
W
SD, EDD load = 15pF
EMA, ECD load = 20pF
(see Note
b
)
5.5
W
5
Maximum long-term
operating junction
temperature
T
j-op
105
°
C