參數(shù)資料
型號： DS3112
廠商： DALLAS SEMICONDUCTOR
元件分類： Digital Transmission Controller
英文描述： DATACOM, FRAMER, PBGA256
封裝： 27 X 27 MM, PLASTIC, BGA-256
文件頁數(shù)： 48/134頁
文件大小： 900K
代理商： DS3112
DS3112
20 of 134
Signal Name:
FRLOS
Signal Description:
T3/E3 Receive Framer Loss Of Signal
Signal Type:
Output
This signal will be forced high when the receive T3/E3 framer is in a Loss Of Signal (LOS) state. It will
remain high as long as the LOS state persists and will return low when the framer exits the LOS state.
See Section 5.3 for details on the set and clear criteria for this signal. LOS status is also available via a
software bit in the T3/E3 Status Register (see Section 5.3).
Signal Name:
FRLOF
Signal Description:
T3/E3 Receive Framer Loss Of Frame
Signal Type:
Output
This signal will be forced high when the receive T3/E3 framer is in a Loss Of Frame (LOF) state. It will
remain high as long as the LOF state persists and will return low when the framer synchronizes. See
Section 5.3 for details on the set and clear criteria for this signal. LOF status is also available via a
software bit in the T3/E3 Status Register (see Section 5.3).
T3/E3 Receive Framer Timing Figure 2.3A
FRCLK
Normal Mode
FRD
(see note)
T3: X1
E3: Bit 1 of FAS
Last Bit of
the Frame
FRCLK
Inverted Mode
ftim
FRDEN
Data Enable Mode for T3
(see note)
FRDEN
Data Enable Mode for E3
(see note)
FRDEN
Gapped Clock Mode for T3
(see note)
FRDEN
Gapped Clock Mode for E3
(see note)
FRSOF
(see note)
Note: FRD, FRDEN, and FRSOF can be inverted via Master Control Register 3.
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DS3131 SPECIALTY TELECOM CIRCUIT, PBGA256
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相關代理商/技術參數(shù)
參數(shù)描述
DS3112+ 功能描述:網(wǎng)絡控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112+W 功能描述:網(wǎng)絡控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1 功能描述:網(wǎng)絡控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1+ 功能描述:網(wǎng)絡控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112DK 功能描述:網(wǎng)絡開發(fā)工具 DS3112 Dev Kit RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類型:Ethernet to Wi-Fi Bridges 工具用于評估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類型:802.11 b/g, Ethernet 工作電源電壓:3.3 V
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