參數(shù)資料
型號： DS3112
廠商： DALLAS SEMICONDUCTOR
元件分類： Digital Transmission Controller
英文描述： DATACOM, FRAMER, PBGA256
封裝： 27 X 27 MM, PLASTIC, BGA-256
文件頁數(shù)： 30/134頁
文件大?。?/td> 900K
代理商： DS3112
DS3112
125 of 134
Unchannelized Dual T3/E3 Application Figure 14.1B
14.2 M13 BASICS
M13 multiplexing is the process of merging 28 T1 lines into a single T3 line. This is a two step process.
First, four of the T1 lines are merged into a single T2 rate and then seven T2 rates are merged to form the
T3. The first step of this process is called a M12 function since it is merging T1 lines into T2. The
second step of this process is called a M23 function since it is merging T2 lines into a T3. The term M13
implies that both M12 and M23 are being performed to map 28 T1 lines into the T3. These two steps are
independent and will be discussed separately.
T Carrier Rates Table 14.2A
T Carrier Level
Nominal Data Rate
T1 / DS1
1.544 Mbps
T2 / DS2
6.312 Mbps
T3 / DS3
44.736 Mbps
T2 Framing Structure
To understand the M12 function requires an understanding of T2 framing. The T2 frame structure is
made up of four subframes called M subframes. See Figure 14.2A. The four M subframes are
transmitted one after another (...M1/M2/M3/M4/M1/M2...) to make up the complete T2 M frame data
structure. Each M subframe is made up of six blocks and each block is made up of 49 bits. The first bit
of each block is dedicated to overhead and the next 48 bits are the information bits where the T1 data will
be placed for transport. The definition of the overhead bits is shown in Table 14.2B and the placement of
the overhead bits is shown in Figure 14.2A.
DS3134
CHATEAU
256
Channel
HDLC
Controller
PCI
Bus
DS3112
TEMPE
T3/E3
Framer &
M13/
E13/
G747
Mux
DS3150
T3/E3
Line
Interface
T3/E3
Line
OC-3/
OC-12/
OC-48
Mux
Optical
I/F
bipolar
I/F
NRZ
I/F
- or -
DS3112
TEMPE
T3/E3
Framer &
M13/
E13/
G747
Mux
DS3150
T3/E3
Line
Interface
T3/E3
Line
OC-3/
OC-12/
OC-48
Mux
Optical
I/F
bipolar
I/F
NRZ
I/F
- or -
44.2Mbps (T3) or
34Mbps (E3)
datastream
44.2Mbps (T3) or
34Mbps (E3)
datastream
相關(guān)PDF資料
PDF描述
DS3131 SPECIALTY TELECOM CIRCUIT, PBGA256
DS3134 DATACOM, FRAMER, PBGA256
DS3150QN DATACOM, PCM TRANSCEIVER, PQCC28
DS3150Q DATACOM, PCM TRANSCEIVER, PQCC28
DS3150TN DATACOM, PCM TRANSCEIVER, PDIP48
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS3112+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112+W 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112DK 功能描述:網(wǎng)絡(luò)開發(fā)工具 DS3112 Dev Kit RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類型:Ethernet to Wi-Fi Bridges 工具用于評估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類型:802.11 b/g, Ethernet 工作電源電壓:3.3 V
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