參數(shù)資料
型號： DS3112
廠商： DALLAS SEMICONDUCTOR
元件分類： Digital Transmission Controller
英文描述： DATACOM, FRAMER, PBGA256
封裝： 27 X 27 MM, PLASTIC, BGA-256
文件頁數(shù)： 39/134頁
文件大?。?/td> 900K
代理商： DS3112
DS3112
133 of 134
E3 Frame Structure Figure 14.3B
Set 1
Bit 1
Bit 384
FAS (1111010000)
RAI
Sn
b11
b21
b31
b41
b12
...bits from the tributaries...
Set 2
Bit 1
Bit 384
c11
c21
c31
c41
...bits from the tributaries...
Set 3
Bit 1
Bit 384
c12
c22
c32
c42
...bits from the tributaries...
Set 4
Bit 1
Bit 384
c12
c22
c32
c42
s1
s2
s3
s4
...bits from the tributaries...
Notes:
1.
bit 1 of set 1 is transmitted first
2.
bji
tributary bits
j = tributary number
i = bit number
3.
cji
justification control bits
j = tributary number
i = control stuffing bit number
4.
sj
stuffing bits
j = tributary number
14.4 G.747 BASICS
G.747 multiplexing is a mixture of T3 and E1. It is the process of merging 21 E1 lines into a single T3
line. This is a two step process. First, three of the E1 lines are merged into a single T2 rate and then
seven T2 rates are merged to form the T3 just like the normal T2 to T3 multiplexing scheme. Once the
three E1 lines have been multiplexed together, the resultant 6.312 Mbps data stream is treated just like a
T2 data stream that contains four T1 lines. We will only discuss the G.747 multiplexing scheme in this
Section. See Section 14.2 for details on the T2 to T3 multiplexing scheme (i.e. M23) and the T3 framing
structure.
G.747 Carrier Rates Table 14.4A
T or E Carrier Level
Nominal Data Rate
E1
2.048 Mbps
T2
6.312 Mbps
T3
44.736 Mbps
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS3112+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112+W 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112DK 功能描述:網(wǎng)絡(luò)開發(fā)工具 DS3112 Dev Kit RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類型:Ethernet to Wi-Fi Bridges 工具用于評估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類型:802.11 b/g, Ethernet 工作電源電壓:3.3 V
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