參數(shù)資料
型號(hào)： ISP1761
廠商： NXP Semiconductors N.V.
英文描述： Hi-Speed Universal Serial Bus On-The-Go controller
中文描述： 高速通用串行總線和On - The - Go控制器
文件頁數(shù)： 149/158頁
文件大?。?/td> 724K
代理商： ISP1761
9397 750 13258
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 12 January 2005
149 of 158
Philips Semiconductors
ISP1761
Hi-Speed USB OTG controller
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
18. Abbreviations
Table 181: Abbreviations
Acronym
ATL
DMA
DSC
EHCI
EMI
FS
FIFO
GPS
HC
HNP
HS
iTD
ISR
INT
ISO
ITL
LS
OHCI
OTG
PCI
PDA
PLL
PIO
PMOS
POR
PTD
QHA
QHA-SS/CS
Description
Acknowledged Transfer List
Direct Memory Access
Digital Still Camera
Enhanced Host Controller Interface
Electro-Magnetic Interference
full-speed
First In, First Out
Global Positioning System
Host Controller
Host Negotiation Protocol
high-speed
isochronous Transfer Descriptor
Interrupt Service Routine
INTerrupt
ISOchronous
Isochronous (ISO) Transfer List
low-speed
Open Host Controller Interface
On-the-Go
Peripheral Component Interconnect
Personal Digital Assistant
Phase-Locked Loop
Programmed Input/Output
Positive-channel Metal-Oxide Semiconductor
Power-On Reset
Philips Transfer Descriptor
Queue Head Asynchronous
Queue Head Asynchronous Start Split and Complete Split
相關(guān)PDF資料
PDF描述
ISP1761BE Hi-Speed Universal Serial Bus On-The-Go controller
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ISP1761BE 功能描述:USB 接口集成電路 USB HS OTG CTRLR RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1761BE,518 功能描述:USB 接口集成電路 USB HS OTG CONTROLLER RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1761BE,551 功能描述:USB 接口集成電路 DO NOT USE ORDER -T OR NO "-" RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1761BE,557 功能描述:USB 接口集成電路 USB HS OTG CTRLR RoHS:否 制造商:Cypress Semiconductor 產(chǎn)品:USB 2.0 數(shù)據(jù)速率: 接口類型:SPI 工作電源電壓:3.15 V to 3.45 V 工作電源電流: 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:WLCSP-20
ISP1761BE518 制造商:ST-Ericsson 功能描述:IC CONTROLLER USB OTG 128LQFP
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