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參數(shù)資料
| 型號： | pentium II xeon processor |
| 廠商： | Intel Corp. |
| 英文描述： | pentium II xeon processor at 400 and 450 MHZ(工作頻率400和450兆赫茲奔II處理器) |
| 中文描述： | 奔騰II至強處理器400和450兆赫（工作頻率400和450兆赫茲奔二處理器） |
| 文件頁數(shù)： | 58/97頁 |
| 文件大?。?/td> | 978K |
| 代理商： | PENTIUM II XEON PROCESSOR |
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PENTIUM II XEON PROCESSOR AT 400 AND 450 MHZ
E
58
12/15/98 5:14 PM 24377002.doc
3770-23
NOTE:
Four thermocouple attach locations at
±
0.015". Thermocouple measurement locations are the expected high temperature
locations, without external heat source influence. Temperature of entire cover surface not to exceed 75
°
C. Ensure that
external heat sources do not cause a violation of T
COVER
requirements.
Figure 23. Guideline Locations for Cover Temperature (T
COVER
) Thermocouple Placement
5.2.3.2.
Cover Temperature Measurement
Guideline
The maximum and minimum S.E.C. cartridge cover
temperature
(T
COVER
)
processors are specified in Table 38. Meeting this
temperature specification is required to ensure
correct and reliable operation of the processor. In the
design of a system, other sources of heat
convection, conduction or radiation should be
evaluated for any possible effect on the cartridge
cover temperature. In a system free from such
external sources of heat, the higher temperature
areas on the cover have been characterized and are
illustrated in Figure 23. If no external heat sources
are present, T
COVER
thermal measurements should
for
Pentium
II
Xeon
be made at these points. The cover is not designed
for thermal solution attachment.
6.0.
MECHANICAL SPECIFICATIONS
Pentium II Xeon processors use S.E.C. cartridge
package technology. The S.E.C. cartridge contains
the processor core, L2 cache and other components.
The S.E.C. cartridge package connects to the
motherboard through an edge connector. Mechanical
specifications for the processor are given in this
section. See Section 1.1.1. for a complete
terminology listing.
Figure 24 shows the thermal plate side view and the
cover side view of the Pentium II Xeon processor.
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