參數(shù)資料
型號(hào)： pentium II xeon processor
廠商： Intel Corp.
英文描述： pentium II xeon processor at 400 and 450 MHZ(工作頻率400和450兆赫茲奔II處理器)
中文描述： 奔騰II至強(qiáng)處理器400和450兆赫（工作頻率400和450兆赫茲奔二處理器）
文件頁(yè)數(shù)： 4/97頁(yè)
文件大小： 978K
代理商： PENTIUM II XEON PROCESSOR
PENTIUM II XEON PROCESSOR AT 400 AND 450 MHZ
E
4
12/16/98 1:24 PM 24377003.doc
5.1.2. PLATE FLATNESS
SPECIFICATION..................................54
5.2. Processor Thermal Analysis........................54
5.2.1. THERMAL SOLUTION
PERFORMANCE .................................54
5.2.2. THERMAL PLATE TO COOLING
SOLUTION INTERFACE
MANAGEMENT GUIDE.......................55
5.2.3. MEASUREMENTS FOR THERMAL
SPECIFICATIONS ...............................57
5.2.3.1. Thermal Plate Temperature
Measurement.................................57
5.2.3.2. Cover Temperature Measurement
Guideline........................................58
6.0. MECHANICAL SPECIFICATIONS.................58
6.1. Weight..........................................................63
6.2. Cartridge to Connector Mating Details.........63
6.3. Pentium II Xeon Processor Substrate
Edge Finger Signal Listing...........................65
7.0. BOXED PROCESSOR SPECIFICATIONS....74
7.1.Introduction...................................................74
7.2.Mechanical Specifications............................74
7.2.1. BOXED PROCESSOR HEATSINK
DIMENSIONS.......................................77
7.2.2. BOXED PROCESSOR HEATSINK
WEIGHT ...............................................78
7.2.3. BOXED PROCESSOR RETENTION
MECHANISM........................................78
7.3.Thermal Specifications.................................78
7.3.1. BOXED PROCESSOR COOLING
REQUIREMENTS ................................78
7.3.2. THERMAL EVALUATION ....................78
8.0. INTEGRATION TOOLS..................................78
8.1.In-Target Probe (ITP) for Pentium II
Xeon Processors......................................78
8.1.1. PRIMARY FUNCTION .........................79
8.1.2. DEBUG PORT CONNECTOR
DESCRIPTION.....................................79
8.1.3. DEBUG PORT SIGNAL
DESCRIPTIONS ..................................79
8.1.4. DEBUG PORT SIGNAL NOTES..........82
8.1.4.1. General Signal Quality Notes ........83
8.1.4.2. Signal Note: DBRESET#...............83
8.1.4.3. Signal Note: TDO and TDI.............83
8.1.4.4. Signal Note: TCK...........................83
8.1.5. USING BOUNDARY SCAN TO
COMMUNICATE TO THE
PROCESSOR.......................................85
8.2.Integration Tool (Logic Analyzer)
Considerations.............................................85
8.2.1. INTEGRATION TOOL MECHANICAL
KEEPOUTS..........................................85
9.0. APPENDIX ......................................................86
9.1.Alphabetical Signals Reference....................86
9.1.1. A[35:03]# (I/O) ......................................86
9.1.2. A20M# (I)..............................................86
9.1.3. ADS# (I/O)............................................86
9.1.4. AERR# (I/O)..........................................86
9.1.5. AP[1:0]# (I/O)........................................86
9.1.6. BCLK (I)................................................87
9.1.7. BERR# (I/O)..........................................87
9.1.8. BINIT# (I/O) ..........................................87
9.1.9. BNR# (I/O)............................................87
9.1.10.
BP[3:2]# (I/O) ...................................87
9.1.11.
BPM[1:0]# (I/O) ................................87
9.1.12.
BPRI# (I)...........................................87
9.1.13.
BR0# (I/O), BR[3:1]# (I)....................87
9.1.14.
D[63:00]# (I/O)..................................89
9.1.15.
DBSY# (I/O).....................................89
9.1.16.
DEFER# (I).......................................89
9.1.17.
DEP[7:0]# (I/O).................................89
9.1.18.
DRDY# (I/O).....................................89
9.1.19.
EMI...................................................89
9.1.20.
FERR# (O).......................................89
9.1.21.
FLUSH# (I).......................................89
9.1.22.
FRCERR (I/O)..................................89
9.1.23.
HIT# (I/O), HITM# (I/O)....................90
9.1.24.
IERR# (O) ........................................90
9.1.25.
IGNNE# (I) .......................................90
9.1.26.
INIT# (I)............................................90
9.1.27.
INTR - SEE LINT[0]..........................90
9.1.28.
LINT[1:0] (I)......................................90
9.1.29.
LOCK# (I/O).....................................91
9.1.30.
NMI - SEE LINT[1] ...........................91
9.1.31.
PICCLK (I)........................................91
9.1.32.
PICD[1:0] (I/O) .................................91
相關(guān)PDF資料
PDF描述
Pentium III cpu with mobile Pentium III processor Mobile Module Connector 2 (MMC-2)(帶移動(dòng)模塊連接器2奔III處理器)
pentium III CPU Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器)
pentium III processor 32 bit Processor Mobile Module(32 位帶移動(dòng)模塊處理器)
Pentium OverDrive Processor Pentium OverDrive Processor With MMX Technology For Pentium Processor-Based System(帶MMX技術(shù)奔騰超速轉(zhuǎn)動(dòng)處理器)
pentium pro processor Pentium Pro Processor with 1MB L2 Cache at 200MHZ(1兆比特L2高速緩存頻率200兆赫茲處理器)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
P-ENV568K3G3 制造商:Panasonic Industrial Company 功能描述:TUNER
PEO14012 制造商:TE Connectivity 功能描述:RELAY SPCO 12VDC
PEO14024 制造商:TE Connectivity 功能描述:RELAY SPCO 24VDC
PEO96742 制造商:Delphi Corporation 功能描述:ASM TERM
PEOODO3A 制造商:MACOM 制造商全稱(chēng):Tyco Electronics 功能描述:Versatile Power Entry Module with Small Footprint
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*