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| 型號： | pentium II xeon processor |
| 廠商： | Intel Corp. |
| 英文描述： | pentium II xeon processor at 400 and 450 MHZ(工作頻率400和450兆赫茲奔II處理器) |
| 中文描述： | 奔騰II至強(qiáng)處理器400和450兆赫（工作頻率400和450兆赫茲奔二處理器） |
| 文件頁數(shù)： | 57/97頁 |
| 文件大?。?/td> | 978K |
| 代理商： | PENTIUM II XEON PROCESSOR |
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E
PENTIUM II XEON PROCESSOR AT 400 AND 450 MHZ
57
12/15/98 5:14 PM 24377002.doc
5.2.3.
MEASUREMENTS FOR THERMAL
SPECIFICATIONS
5.2.3.1.
Thermal Plate Temperature
Measurement
To ensure functional and reliable
operation, the processor’s thermal plate temperature
(T
PLATE
) must be maintained at or below the
maximum T
PLATE
and at or above the minimum
T
PLATE
specified in Table 38. Power from the
processor core and L2 cache is transferred to the
thermal plate at 2 locations on the 512-Kbyte L2
cache product, 3 locations on the 1-Mbyte L2 cache
products, and 5 locations on the 2-Mbyte L2 cache
products. Figure 20 shows the locations for T
PLATE
measurement directly above these transfer locations.
Figure 23 shows the 4 locations for T
COVER
measurement, directly above component locations
on the back side of the processor substrate.
processor
Thermocouples are used to measure T
PLATE
and
special care is required to ensure an accurate
temperature measurement. Before taking any
temperature measurements, the thermocouples must
be calibrated. When measuring the temperature of a
surface,
errors
can
be
measurement if
not
handled
measurement errors can be due to a poor thermal
contact between the thermocouple junction and the
measured surface, conduction through thermocouple
leads, heat loss by radiation and convection, or by
contact between the thermocouple cement and the
introduced
properly.
in
the
Such
heatsink base. To minimize these errors, the
following approach is recommended:
Use 36 gauge or finer diameter K, T, or J type
thermocouples. Intel’s laboratory testing was
done using a thermocouple made by Omega*
(part number: 5TC-TTK-36-36).
Attach each thermocouple bead or junction to the
top surface of the thermal plate at the locations
specified in Figure 20 using high thermal
conductivity cements.
A thermocouple should be attached at a 0° angle
if no heatsink is attached to the thermal plate. If a
heatsink is attached to the thermal plate but the
heatsink does not cover the location specified for
T
PLATE
measurement, the thermocouple should
be attached at a 0° angle (refer to Figure 21).
The thermocouple should be attached at a 90°
angle if a heatsink is attached to the thermal
plate and the heatsink covers the location
specified for T
PLATE
measurement (refer to
Figure 22).
The hole size through the heatsink base to route
the thermocouple wires out should be smaller
than 0.150" in diameter.
Make sure there is no contact between the
thermocouple cement and heatsink base. This
contact will affect the thermocouple reading.
3770-21
Figure 21. Technique for Measuring T
PLATE
with 0° Angle Attachment
3770-22
Figure 22. Technique for Measuring T
PLATE
with 90° Angle Attachment
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