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參數(shù)資料
| 型號(hào)： | pentium III processor |
| 廠商： | Intel Corp. |
| 英文描述： | 32 bit Processor Mobile Module(32 位帶移動(dòng)模塊處理器) |
| 中文描述： | 32位處理器的移動(dòng)模塊（32位帶移動(dòng)模塊處理器） |
| 文件頁(yè)數(shù)： | 1/67頁(yè) |
| 文件大小： | 834K |
| 代理商： | PENTIUM III PROCESSOR |
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Pentium
III Processor Mobile Module:
Mobile Module Connector 2 (MMC-2)
Featuring Intel
SpeedStep
Technology
Datasheet
Product Features
I
Mobile Pentium
III
processor featuring
Intel SpeedStep technology with processor
speeds of 750/600 MHz, 700/550 MHz,
650/500 MHz, and 600/500 MHz
I
On-die, primary 16-K Instruction cache and
16-K Write Back Data cache
I
On-die, 256-K L2 cache
—Eight-way set associative
—Runs at the speed of the processor core
I
Fully compatible with previous Intel
mobile microprocessors
—Binary compatible with all applications
—Support for MMX
technology
I
Supports streaming SIMD
I
Power management features that provide
low-power dissipation
—Quick Start mode
—Deep Sleep mode
I
Integrated math co-processor
I
Integrated active thermal feedback (ATF)
system
I
Programmable trip point interrupt or poll
mode for temperature reading
I
Intel 82443BX Host Bridge system
controller
—DRAM controller supports 3.3-V
SDRAM at 100 MHz
—Supports PCI CLKRUN# protocol
—SDRAM clock enable support and self-
refresh of SDRAM during Suspend
mode
—PCI bus control 3.3V only,
PCI
Specification, Revision 2.1
compliant
I
Supports single AGP 66-MHz, 3.3-V
device
I
Two-piece thermal transfer plate (TTP) for
heat dissipation
—The CPU TTP is made of nickel-plated
copper
—The BX TTP is made of aluminum
I
Mobile Pentium
III
processor core voltage
regulation supports input voltages from
7.5V to 21.0V DC
—Above 80% peak efficiency
—Integrated VR solution
243356-005
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