參數(shù)資料
型號: pentium III processor
廠商: Intel Corp.
英文描述: 32 bit Processor Mobile Module(32 位帶移動模塊處理器)
中文描述: 32位處理器的移動模塊(32位帶移動模塊處理器)
文件頁數(shù): 26/67頁
文件大?。?/td> 834K
代理商: PENTIUM III PROCESSOR
Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep
Technology
20
Datasheet
243356-005
Figure 2. MMC-2 Connector Pad Footprint
Table 13
summarizes some of the key connector specifications.
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Table 13. Connector Specifications
Parameter
Condition
Specification
Material
Contact
Copper Alloy
Housing
Thermo-Plastic Molded Compound: LCP
Electrical
Current
0.5A
Voltage
50 VAC
Insulation Resistance
100 M
Termination Resistance
20-m
maximum at 20-mV open circuit with 10 mA
Capacitance
5-pF maximum per contact
Mechanical
Mating Cycles
50 cycles
Connector Mating Force
50-lbs (22.7 kg) maximum
Contact Unmating Force
30-lbs (13.6 kg) maximum
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