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參數(shù)資料
| 型號： | pentium III processor |
| 廠商： | Intel Corp. |
| 英文描述： | 32 bit Processor Mobile Module(32 位帶移動模塊處理器) |
| 中文描述： | 32位處理器的移動模塊（32位帶移動模塊處理器） |
| 文件頁數(shù)： | 5/67頁 |
| 文件大?。?/td> | 834K |
| 代理商： | PENTIUM III PROCESSOR |
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243356-005
Datasheet
v
Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep
Technology
19
20
21
22
23
24
25
26
Board Dimensions and MMC-2 Connector—Pin 1 Orientation ...........................54
Printed Circuit Board Thickness..........................................................................54
Height Restrictions .............................................................................................55
82443BX Thermal Transfer Plate (Reference Only) ..........................................56
82443BX Thermal Transfer Plate Detail..............................................................56
CPU Thermal Transfer Plate (Reference Only)...................................................57
Standoff Holes, Board Edge Clearance, and EMI Containment Ring .................58
Product Tracking Code........................................................................................61
Tables
1
2
3
4
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9
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11
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28
29
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31
Connector Signal Summary ..................................................................................5
Memory Signal Descriptions..................................................................................7
AGP Signal Descriptions.......................................................................................8
PCI Signal Descriptions.......................................................................................10
Intel SpeedStep Technology Signal Description.................................................11
Processor and PIIX4E/M Sideband Signal Descriptions.....................................12
Power Management Signal Descriptions ............................................................13
Clock Signal Descriptions....................................................................................14
Voltage Descriptions ...........................................................................................15
ITP and JTAG Pins..............................................................................................16
Miscellaneous Pin Descriptions...........................................................................16
Connector Pin Assignment..................................................................................17
Connector Specifications.....................................................................................20
Configuration Straps for the 82443BX Host Bridge System Controller...............22
Clock State Characteristics.................................................................................24
Power Consumption Values I..............................................................................28
Power Consumption Values II.............................................................................29
Power Consumption Values III............................................................................29
BCLK DC Specifications......................................................................................30
BCLK AC Specifications at the Processor Core Pins..........................................30
BCLK Signal Quality AC Specifications at the Processor Core...........................31
System Power Requirements..............................................................................32
Vcore Power Conversion Efficiency at 1.60V......................................................33
Vcore Power Conversion Efficiency at 1.35V......................................................33
Voltage Signal Definitions and Sequences .........................................................35
VR_ON In-rush Current.......................................................................................36
Bulk Capacitance Requirements per Power Plane .............................................38
Thermal Sensor SMBus Address........................................................................51
Thermal Sensor Configuration Register..............................................................51
Thermal Design Power (TDPMODULE) Specification ........................................58
Environmental Standards....................................................................................61
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