參數(shù)資料
型號(hào): pentium III processor
廠商: Intel Corp.
英文描述: 32 bit Processor Mobile Module(32 位帶移動(dòng)模塊處理器)
中文描述: 32位處理器的移動(dòng)模塊(32位帶移動(dòng)模塊處理器)
文件頁(yè)數(shù): 59/67頁(yè)
文件大?。?/td> 834K
代理商: PENTIUM III PROCESSOR
Pentium
III Processor Mobile Module MMC-2
Featuring Intel
SpeedStep
Technology
243356-005
Datasheet
53
Figure 19. Board Dimensions and MMC-2 Connector—Pin 1 Orientation
6.1.2
Printed Circuit Board
Figure 20
shows the minimum and maximum thickness of the printed circuit board (PCB). The
range of PCB thickness allows for different PCB technologies to be used with current and future
Intel mobile modules.
Note:
The system manufacturer must ensure that the mechanical restraining method and/or system-level
EMI contacts are able to support this range of PCB for compatibility with future Intel mobile
modules.
Figure 20. Printed Circuit Board Thickness
Min: 0.90 mm
Max: 1.10 mm
Printed Circuit Board
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