參數(shù)資料
型號(hào): 28F3204C3
廠商: Intel Corp.
英文描述: 3 V Advanced+ Stacked Chip Scale Package Memory(3V高級(jí)堆芯片封裝存儲(chǔ)器)
中文描述: 3伏高級(jí)堆疊芯片級(jí)封裝存儲(chǔ)器(3V的高級(jí)堆芯片封裝存儲(chǔ)器)
文件頁(yè)數(shù): 41/62頁(yè)
文件大小: 538K
代理商: 28F3204C3
E
12.0 ORDERING INFORMATION
28F1602C3, 28F3204C3
41
PRODUCT PREVIEW
R D 2 8 F 1 6 0
C 3 T 9 0
Package
RD = 8x12 Ball Matrix CSP
Product line designator
for all Intel
Flash products
Access Speed (ns)
16 Mbit = 90, 110
32 Mbit = 110
Product Family
C3 = 3 V Advanced+ Boot Block
V
CC
= 2.7 V - 3.6 V
V
= 1.65 V - 3.6 V or
11.4 V - 12.6 V
Flash Device Density
320 = x16 (32 Mbit)
160 = x16 (16 Mbit)
T =
Top Blocking
B =
Bottom Blocking
2
SRAM Device Density
4 = x16 (4 Mbit)
2 = x16 (2 Mbit)
order
VALID COMBINATIONS (All Extended Temperature)
RD28F1602C390
RD28F1602C3110
RD28F3204C3110
NOTE:
90 ns access speed available at production (high volume).
13.0 ADDITIONAL INFORMATION
(1,2)
Order Number
Document/Tool
210830
Flash Memory Databook
292216
AP-658 Designing for Upgrade to the Advanced+ Boot Block Flash Memory
292215
AP-657 Designing with the Advanced+ Boot Block Flash Memory
Architecture
Contact your Intel
Representative
Flash Data Integrator (FDI) Software Developer’s Kit
297874
FDI Interactive: Play with Intel’s Flash Data Integrator on Your PC
NOTES:
1.
Please call the Intel Literature Center at (800) 548-4725 to request Intel documentation. International customers should
contact their local Intel or distribution sales office.
Visit Intel’s World Wide Web home page at http://www.Intel.com or http://developer.intel.com for technical documentation
and tools.
2.
相關(guān)PDF資料
PDF描述
28F1604C3 3 Volt Advanced+ Stacked Chip Scale Package Memory(3V閃速存儲(chǔ)器和靜態(tài)存儲(chǔ)器)
28F160C18 1.8V Advanced+ Boot Block Flash Memory(1.8V高級(jí)引導(dǎo)塊閃速存儲(chǔ)器)
28F160C2 2.4V Advanced+ Boot Block Flash Memory(2.4V高級(jí)引導(dǎo)塊閃速存儲(chǔ)器)
28F800C2 2.4V Advanced+ Boot Block Flash Memory(2.4V高級(jí)引導(dǎo)塊閃速存儲(chǔ)器)
28F160S3 3 V FlashFile Memory(3 V FlashFile 存儲(chǔ)器)
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