參數(shù)資料
型號(hào): STPCI2EEYC
廠商: STMICROELECTRONICS
元件分類: 外設(shè)及接口
英文描述: MULTIFUNCTION PERIPHERAL, PBGA516
封裝: PLASTIC, BGA-516
文件頁(yè)數(shù): 73/80頁(yè)
文件大?。?/td> 854K
代理商: STPCI2EEYC
MECHANICAL DATA
75/80
Issue 0.4 - July 16, 2001
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
6.2 516-Pin Package Thermal Data
516-pin PBGA package has a Power Dissipation
Capability of 4.5W which increases to 6W when
used with a Heatsink.
The structure in shown inFigure 6-4.
Thermal dissipation options are illustrated inFig-
ure 6-5 and Figure 6-6.
Figure 6-4. 516-Pin PBGA Structure
Thermal balls
Power & Ground layers
Signal layers
Figure 6-5. Thermal Dissipation Without Heatsink
Ambient
Case
Junction
Board
Ambient
Case
Junction
Board
Rca
Rjc
Rjb
Rba
66
125
8.5
Rja = 13
°C/W
Airflow = 0
Board dimensions:
The PBGA is centred on board
Copper thickness:
-17
m for internal layers
-34
m for external layers
- 10.2 cm x 12.7 cm
- 4 layers (2 for signals, 1 GND, 1VCC)
There are no other devices
1 via pad per ground ball (8-mil wire)
40% copper on signal layers
Board temperature taken at the centre balls
Board
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