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參數(shù)資料
| 型號： | STPCI2EEYC |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | MULTIFUNCTION PERIPHERAL, PBGA516 |
| 封裝： | PLASTIC, BGA-516 |
| 文件頁數(shù)： | 51/80頁 |
| 文件大?。?/td> | 854K |
| 代理商： | STPCI2EEYC |
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BOARD LAYOUT
55/80
Issue 0.4 - July 16, 2001
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
When considering thermal dissipation, the most
important - and not always the most obvious - part
of the layout is the connection between the ground
balls and the ground layer.
A 1-wire connection is shown in Figure 5-2. The
use of a 8-mil wire results in a thermal resistance
of 105
°C/W assuming copper is used (418 W/
m.
°K). This high value is due to the thickness (34
m) of the copper on the external side of the PCB.
Considering only the central matrix of 36 thermal
balls and one via for each ball, the global thermal
resistance is 2.9
°C/W. This can be easily im-
proved using four 10 mil wires to connect to the
four vias around the ground pad link as inFigure
5-3. This gives a total of 49 vias and a global re-
sistance for the 36 thermal balls of 0.6
°C/W.
The use of a ground plane like in Figure 5-4 is
even better.
To avoid solder wicking over to the via pads during
soldering, it is important to have a solder mask of
4 mil around the pad (NSMD pad). This gives a di-
ameter of 33 mil for a 25 mil ground pad.
To obtain the optimum ground layout, place the
vias directly under the ball pads. In this case no lo-
cal board distortion is tolerated.
The thickness of the copper on PCB layers is typ-
ically 34
m for external layers and 17 m for in-
ternal layers. This means that thermal dissipation
is not good; high board temperatures are concen-
trated around the devices and these fall quickly
with increased distance.
Where possible, place a metal layer inside the
PCB; this improves dramatically the spread of
heat and hence the thermal dissipation of the
board.
Figure 5-2. Recommended 1-wire Ground Pad Layout
Figure 5-3. Recommended 4-wire Ground Pad Layout
Solder Mask (4 mil)
Pad for ground ball (diameter = 25 mil)
Hole to ground layer (diameter = 12 mil)
Connection Wire (width = 10 mil)
Via (diameter = 24 mil)
34
.5m
il
1 mil = 0.0254 mm
4 via pads for each ground ball
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| STPCI2GDY | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core PC Compatible System-on-Chip for Terminals |
| STPCI2GDYI | 功能描述:微處理器 - MPU 120MHz x86 SoC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| STPCI2GDYIE | 制造商:STMicroelectronics 功能描述: |
| STPCI2HDYC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PERIPHERAL (MULTIFUNCTION) CONTROLLER |
| STPCI2HEYC | 功能描述:微處理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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