參數(shù)資料
型號： STPCI2EEYC
廠商： STMICROELECTRONICS
元件分類： 外設(shè)及接口
英文描述： MULTIFUNCTION PERIPHERAL, PBGA516
封裝： PLASTIC, BGA-516
文件頁數(shù)： 52/80頁
文件大?。?/td> 854K
代理商： STPCI2EEYC
BOARD LAYOUT
Issue 0.4 - July 16, 2001
56/80
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
The PBGA Package also dissipates heat through
peripheral ground balls. When a heat sink is
placed on the device, heat is more uniformly
spread throughout the moulding, increasing heat
dissipation through the peripheral ground balls.
The more via pads that are connected to each
ground ball, the more heat is dissipated. The only
limitation is the risk of losing routing channels.
Figure 5-5 shows a routing with a good trade off
between thermal dissipation and the number of
routing channels.
Figure 5-4. OptimumLlayout for Central Ground Ball
Via to Ground layer
Pad for ground ball
Clearance = 6mil
diameter = 25 mil
hole diameter = 14 mil
Solder mask
diameter = 33 mil
External diameter = 37 mil
connections = 10 mil
Figure 5-5. Global Ground Layout for Good Thermal Dissipation
Top Vie w
1
A
V iato g ro un dla y e r
G round pad
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
STPCI2GDY 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core PC Compatible System-on-Chip for Terminals
STPCI2GDYI 功能描述:微處理器 - MPU 120MHz x86 SoC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
STPCI2GDYIE 制造商:STMicroelectronics 功能描述:
STPCI2HDYC 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PERIPHERAL (MULTIFUNCTION) CONTROLLER
STPCI2HEYC 功能描述:微處理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324
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