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參數(shù)資料
| 型號： | STPCI2EEYC |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 外設(shè)及接口 |
| 英文描述： | MULTIFUNCTION PERIPHERAL, PBGA516 |
| 封裝： | PLASTIC, BGA-516 |
| 文件頁數(shù)： | 50/80頁 |
| 文件大小： | 854K |
| 代理商： | STPCI2EEYC |
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BOARD LAYOUT
Issue 0.4 - July 16, 2001
54/80
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.
5. BOARD LAYOUT
5.1 Thermal dissipation
Thermal dissipation of the STPC depends mainly
on supply voltage. When the system does not
need to work at 3.45 V, it may therefore be bene-
ficial to reduce the voltage to 3.15 V, where possi-
ble. This could save a few 100’s of mW.
The second area to look at is unused interfaces
and functions. Depending on the application,
some input signals can be grounded, and some
blocks not powered or shutdown. Clock speed dy-
namic adjustment is also a solution that can be
used along with the integrated power manage-
ment unit.
The standard way to route thermal balls to internal
ground layer implements only one via pad for each
ball pad, connected using a 8-mil wire.
With such configuration the Plastic BGA 516 pack-
age does 90% of the thermal dissipation through
the ground balls, and especially the central ther-
mal balls which are directly connected to the die.
The remaining 10% is dissipated through the
case. Adding a heat sink reduces this value to
85%.
As a result, some basic rules must be followed
when routing the STPC in order to avoid thermal
problems.
Firstly, the whole ground layer acts as a heat sink
and ground balls must be directly connected to it,
as illustrated in Figure 5-1.
If one ground layer is not enough, a second
ground plane may be added onthe solder side.
Figure 5-1. Ground Routing
Thru hole to ground layer
T op
Laye
r: Sig
n als
G rou
n d lay
e r
P ow e
r laye
r
B otto
m La
yer:
signa
ls + lo
cal g
ro und
la yer
(if ne
e ded
)
Pad for ground ball
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| STPCI2GDY | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core PC Compatible System-on-Chip for Terminals |
| STPCI2GDYI | 功能描述:微處理器 - MPU 120MHz x86 SoC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| STPCI2GDYIE | 制造商:STMicroelectronics 功能描述: |
| STPCI2HDYC | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:PERIPHERAL (MULTIFUNCTION) CONTROLLER |
| STPCI2HEYC | 功能描述:微處理器 - MPU 133MHz x86 SoC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324 |
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