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參數(shù)資料
| 型號(hào)： | P95020NQG8 |
| 廠商： | INTEGRATED DEVICE TECHNOLOGY INC |
| 元件分類： | 電源管理 |
| 英文描述： | 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, QCC132 |
| 封裝： | 10 X 10 MM, 0.85 MM HEIGHT, QFN-132 |
| 文件頁數(shù)： | 76/169頁 |
| 文件大?。?/td> | 4297K |
| 代理商： | P95020NQG8 |
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IDTP95020
Product Datasheet
September 2, 2011 Revision 1.3 Final
167
2011 Integrated Device Technology, Inc.
The maximum limits that can be expected for a given
ambient condition can be estimated by the following
discussion.
Implementation of integrated circuits in low-profile and
fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-
dependant issues such as thermal coupling, airflow,
added heat sinks, and convection surfaces, and the
presence of other heat-generating components, affect the
power-dissipation limits of a given component.
Three basic approaches for enhancing thermal
performance are listed below:
1. Improving the power dissipation capability of the
PCB design
2. Improving the thermal coupling of the component
to the PCB
3. Introducing airflow into the system
First, the maximum power dissipation for a given situation
should be calculated:
PD(MAX) = (TJ(MAX) - TA)/θJA
Where:
PD(MAX) = Maximum Power Dissipation
θJA = Package Thermal Resistance (°C/W)
TJ(MAX) = Maximum Device Junction Temperature (°C)
TA = Ambient Temperature (°C)
The maximum recommended junction temperature (TJ(MAX))
for the IDTP95020 device is 125°C. The thermal
resistance of the 132-pin NQG package (NGQ132) is
optimally θJA = 23.5°C/W. Operation is specified to a
maximum steady-state ambient temperature (TA) of 70°C.
Therefore, the maximum recommended power dissipation
is:
PD(Max) = (125°C - 70°C) / 23.5°C/W = 2.34W
At lower ambient temperatures (TA), the maximum power
dissipation will be less than 2.34W. Given that the
maximum programmable input current is limited to less
than 2.1A, the maximum power dissipation in an operating
system will be less than 2.34W with correct thermal PCB
board layout practices since all power devices will have
limited operating current. Also, the thermal overload
protection as described in the next section can be
programmed to provide additional precautions.
Thermal Overload Protection
The IDTP95020 integrates thermal overload protection
circuitry to prevent damage resulting from excessive
thermal stress that may be encountered under fault
conditions. This circuitry is programmable in the ADC
Module and can shutdown or reset the device when used
with the PCON Module if the die temperature exceeds
125°C. Lower temperature trip points can also be
programmed into the ADC Module. To allow the maximum
charging current and load current on each regulator, and
to prevent thermal overload, it is important to ensure that
the heat generated by the IDTP95020 is dissipated into
the PCB. The package’s exposed paddle must be
soldered to the PCB, with multiple vias tightly packed
under the exposed paddle to ensure optimum thermal
contact to the ground plane.
Special Notes
Registers
Note 1: DO NOT WRITE to registers containing all
RESERVED bits.
NQG QFN-132 Package Assembly
Note 1: Unopened Dry Packaged Parts have a one year
shelf life.
Note 2: Newly opened Dry Packaged Parts HIC indicator
card should be checked, if there is any moisture content,
the parts need to be baked for minimum of 8 hours at 125
C within 24 hours of the assembly reflow process.
Note 3: Opened Dry Packaged parts that are not
assembled within 168 hours of opening must be baked for
minimum of 8 hours at 125C within 24 hours of the
assembly reflow process.
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