參數(shù)資料
型號： P95020NQG8
廠商： INTEGRATED DEVICE TECHNOLOGY INC
元件分類： 電源管理
英文描述： 2-CHANNEL POWER SUPPLY MANAGEMENT CKT, QCC132
封裝： 10 X 10 MM, 0.85 MM HEIGHT, QFN-132
文件頁數(shù)： 115/169頁
文件大小： 4297K
代理商： P95020NQG8
IDTP95020
Product Datasheet
September 2, 2011 Revision 1.3 Final
5
2011 Integrated Device Technology, Inc.
ABSOLUTE MAXIMUM RATINGS
Stresses above the ratings listed below can cause permanent
damage to the IDTP95020. These ratings are stress ratings
only. Functional operation of the device at these or any other
conditions above those indicated in the operational sections of
the specifications is not implied.
Exposure to absolute
maximum rating conditions for extended periods can affect
product reliability. Electrical parameters are guaranteed only
over the recommended operating temperature range.
Table 1. Absolute Maximum Ratings
SYMBOL
PARAMETER
MIN MAX
UNIT
CHRG_INPUT to CHRG_GND
USB or AC adaptor Charger Input
(Transient t < 1ms, Duty Cycle < 1%)
-0.3
7
V
CHRG_BAT to DGND
Battery Input Source
-0.3
5.5
V
CHRG_SYSVCC to DGND
System VCC Output (Vsys)
-0.3
5.5
V
PVDD to PGND
CLASS_D BTL Input Power
-0.3
6
V
LDO_IN1, IN2, IN3 to DGND
Input voltage for LDO
-0.3
6
V
BUCK500_0_IN to BUCK500_0_GND
BUCK0 Input voltage
-0.3
6
V
BUCK500_1_IN to BUCK500_1_GND
BUCK1 Input voltage
-0.3
6
V
BUCK1000_IN to BUCK1000_GND
BUCK2 Input voltage
-0.3
6
V
FDBK to DGND
BUCK0, 1, 2 feedback voltage
-0.3
6
V
LED_BOOST_VIN to LED_BOOST_GND
LED_BOOST Converter gate bias supply
-0.3
6
V
LED_BOOST_GATE to LED_BOOST_GND
LED_BOOST Gate Drive to Power FET
-0.3
LED_BOOST_VIN + 0.3
V
LED_BOOST_VSENSE to LED_BOOST_GND
Voltage Sense Input
-0.3
LED_BOOST_VIN + 0.3
V
LED_BOOST_ISENSE to LED_BOOST_GND
Current Sense Input
-0.3
LED_BOOST_VIN + 0.3
V
LED_BOOST_SINK to LED_BOOST_GND
Current Sink for LED String #1 or String #2 -0.3
6
V
BOOST5_OUT to BOOST5_GND
BOOST5 Converter Output
-0.3
6
V
BOOST5_SW to BOOST5_GND
BOOST5 Converter Power Switch1 and
Switch2
-0.3
6
V
HSPWR to DGND
Hot Swap Switches Power
-0.3
6
V
HSCTRL1, HSCTRL2 to DGND
Input voltage for Hot Swap Control
-0.3
HSPWR + 0.3
V
VDDIO_CK to CKGEN_GND
Power Supply for TCXO_OUT1,
TCXO_OUT2
-0.3
2.5
V
TCXO_IN to CKGEN_GND
Input voltage for TCXO_IN
-0.3
VDD_CKGEN18 + 0.3
V
32KHZ_CLKIN to CKGEN_GND
Input voltage for 32KHZ_CLK
-0.3
LDO_LP + 0.3
V
GPIO to DGND
Input voltage for GPIO
-0.3
CHRG_SYSVCC + 0.3
V
SDA, SCL to DGND
Input voltage for I2C Master or Slave
-0.3
6
V
BCLK, WS, SDOUT, SDIN to DGND
Input voltage for I2S channel 1 or 2
-0.3
LDO_050_0 + 0.3
V
EX_ROM to DGND
External ROM enable
-0.3
CHRG_SYSVCC + 0.3
V
AGND, LDO_GND, CKGEN_GND, GND,
PGND, BOOST5_GND, BCUCK500_0_GND,
BCUCK500_1_GND, BUCK1000_GND,
LED_BOOST_GND, CHRG_GND,
GND_BAT/ADCGND to DGND
-0.3
0.3
V
TJ
Operating Junction Temperature
-40 to +125
°C
TS
Storage Temperature
-40 to +150
°C
TSOLDER
Soldering Temperature
260°C for 10 seconds
°C
ESD Rating
(HBM) Human Body Model
(all pins except A62, A63, B52, B53)
±1500
V
(HBM) Human Body Model
(only pins A62, A63, B52, B53)
±450
(CDM) Charged Device Model (all pins)
± 500
(MM) Machine Model (all pins)
± 200
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