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參數(shù)資料
| 型號(hào)： | STPC12HEYC |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | X86 Core PC Compatible System-on-Chip for Terminals |
| 中文描述： | x86內(nèi)核PC兼容系統(tǒng)上的終端芯片 |
| 文件頁(yè)數(shù)： | 74/111頁(yè) |
| 文件大?。?/td> | 1896K |
| 代理商： | STPC12HEYC |
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MECHANICAL DATA
74/111
Issue 1.0 - July 24, 2002
5.3. SOLDERING RECOMMENDATIONS
High quality, low defect soldering requires
identifying the
optimum temperature profile
for
reflowing the solder paste, therefore optimizing
the process. The heating and cooling rise rates
must be compatible with the solder paste and
components. A typical profile consists of a
preheat, dryout, reflow and cooling sections.
The most critical parameter in the
preheat
section
is to minimize the rate of temperature rise
to less than
2°
C / second, in order to minimize
thermal
shock
on
components.
the
semi-conductor
Dryout section
is used primarily to ensure that
the solder paste is fully dried before hitting reflow
temperatures.
Solder reflow is accomplished in the
reflow zone
,
where the solder paste is elevated to a
temperature greater than the melting point of the
solder. Melting temperature must be exceeded by
approximately 20
°
C to ensure quality reflow.
In reality the profile is not a line, but rather
a range
of temperatures
all solder joints must be
exposed. The total temperature deviation from
component thermal mismatch, oven loading and
oven uniformity must be within the band.
Figure 5-7. Reflow soldering temperature range
Temperature (
°
C )
Time ( s )
PREHEAT
DRYOUT
REFLOW
COOLING
240
0
250
200
150
100
50
0
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| STPCATLAS | X86 Core PC Compatible System-on-Chip for Terminals |
| STPC12HDYC | X86 Core PC Compatible System-on-Chip for Terminals |
| STPC12HDYI | X86 Core PC Compatible System-on-Chip for Terminals |
| STPCD0166BTA3 | PC Compatible Embedded Microprocessor |
| STPCD0166BTC3 | PC Compatible Embedded Microprocessor |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| STPC12HEYI | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core PC Compatible System-on-Chip for Terminals |
| STPC1MBBL | 制造商:Panduit Corp 功能描述: |
| STPC1MBGR | 制造商:Panduit Corp 功能描述:Cable Assembly STP 1m 26AWG Modular Plug to Modular Plug PL-PL |
| STPC3MBBL | 制造商:Panduit Corp 功能描述: |
| STPC3MBGR | 制造商:Panduit Corp 功能描述:Cable Assembly STP 3m 26AWG Modular Plug to Modular Plug PL-PL |
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