參數(shù)資料
型號: STPC12HEYC
廠商: 意法半導(dǎo)體
英文描述: X86 Core PC Compatible System-on-Chip for Terminals
中文描述: x86內(nèi)核PC兼容系統(tǒng)上的終端芯片
文件頁數(shù): 101/111頁
文件大小: 1896K
代理商: STPC12HEYC
DESIGN GUIDELINES
Issue 1.0 - July 24, 2002
101/111
When considering thermal dissipation, one of the
most important parts of the layout is the
connection between the ground balls and the
ground layer.
A 1-wire connection is shown in
Figure 6-32
. The
use of a 8-mil wire results in a thermal resistance
of 105°C/W assuming copper is used (418 W/
m.°K). This high value is due to the thickness (34
μm) of the copper on the external side of the PCB.
Considering only the central matrix of 36 thermal
balls and one via for each ball, the global thermal
resistance is 2.9°C/W. This can be easily
improved using four 12.5 mil wires to connect to
the four vias around the ground pad link as in
Figure 6-33
. This gives a total of 49 vias and a
global resistance for the 36 thermal balls of 0.5°C/
W.
The use of a ground plane like in
Figure 6-34
is
even better.
Figure 6-32. Recommended 1-wire Power/Ground Pad Layout
Solder Mask (4 mil)
Pad for ground ball (diameter = 25 mil)
Hole to ground layer (diameter = 12 mil)
Connection Wire (width = 12.5 mil)
Via (diameter = 24 mil)
345ml
1 mil = 0.0254 mm
Figure 6-33. Recommended 4-wire Ground Pad Layout
4 via pads for each ground ball
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