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參數(shù)資料
| 型號： | STPC12HEYC |
| 廠商： | 意法半導(dǎo)體 |
| 英文描述： | X86 Core PC Compatible System-on-Chip for Terminals |
| 中文描述： | x86內(nèi)核PC兼容系統(tǒng)上的終端芯片 |
| 文件頁數(shù)： | 100/111頁 |
| 文件大?。?/td> | 1896K |
| 代理商： | STPC12HEYC |
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DESIGN GUIDELINES
100/111
Issue 1.0 - July 24, 2002
6.4.5. THERMAL DISSIPATION
6.4.5.1. Power saving
Thermal dissipation of the STPC depends mainly
on supply voltage. When the system does not
need to work at the upper voltage limit, it may
therefore be beneficial to reduce the voltage to the
lower voltage limit, where possible. This could
save a few 100’s of mW.
The second area to look at is unused interfaces
and functions. Depending on the application,
some input signals can be grounded, and some
blocks not powered or shutdown. Clock speed
dynamic adjustment is also a solution that can be
used
along
with
the
management unit.
integrated
power
6.4.5.2. Thermal balls
The standard way to route thermal balls to ground
layer implements only one via pad for each ball
pad, connected using a 8-mil wire.
With such configuration the Plastic BGA package
does 90% of the thermal dissipation through the
ground balls, and especially the central thermal
balls which are directly connected to the die. The
remaining 10% is dissipated through the case.
Adding a heat sink reduces this value to 85%.
As a result, some basic rules must be followed
when routing the STPC in order to avoid thermal
problems.
As the whole ground layer acts as a heat sink, the
ground balls must be directly connected to it, as
illustrated in
Figure 6-31
. If one ground layer is not
enough, a second ground plane may be added.
When possible, it is important to avoid other
devices on-board using the PCB for heat
dissipation, like linear regulators, as this would
heat the STPC itself and reduce the temperature
range of the whole system, In case these devices
can not use a separate heat sink, they must not be
located just near the STPC
Figure 6-31. Ground Routing
Thru hole to ground layer
Top Layer: Signals
Power layer
Internal Layer: Signals
Bottom Layer: Ground layer
Pad for ground ball
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| STPCATLAS | X86 Core PC Compatible System-on-Chip for Terminals |
| STPC12HDYC | X86 Core PC Compatible System-on-Chip for Terminals |
| STPC12HDYI | X86 Core PC Compatible System-on-Chip for Terminals |
| STPCD0166BTA3 | PC Compatible Embedded Microprocessor |
| STPCD0166BTC3 | PC Compatible Embedded Microprocessor |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| STPC12HEYI | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:X86 Core PC Compatible System-on-Chip for Terminals |
| STPC1MBBL | 制造商:Panduit Corp 功能描述: |
| STPC1MBGR | 制造商:Panduit Corp 功能描述:Cable Assembly STP 1m 26AWG Modular Plug to Modular Plug PL-PL |
| STPC3MBBL | 制造商:Panduit Corp 功能描述: |
| STPC3MBGR | 制造商:Panduit Corp 功能描述:Cable Assembly STP 3m 26AWG Modular Plug to Modular Plug PL-PL |
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