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參數(shù)資料
| 型號(hào)： | DSP1628 |
| 英文描述： | TVS 400W 60V BIDIRECT SMA |
| 中文描述： | 澄清，串行I /設(shè)備的DSP1620/27/28/29 O控制注冊說明 |
| 文件頁數(shù)： | 82/114頁 |
| 文件大?。?/td> | 804K |
| 代理商： | DSP1628 |
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Preliminary Data Sheet
February 1997
DSP1628 Digital Signal Processor
80
Lucent Technologies Inc.
8 Device Characteristics
(continued)
8.4 Package Thermal Considerations
The recommended operating temperature specified above is based on the maximum power, package type, and
maximum junction temperature. The following equations describe the relationship between these parameters. If the
applications' maximum power is less than the worst-case value, this relationship determines a higher maximum am-
bient temperature or the maximum temperature measured at top dead center of the package.
T
A
= T
J
– P x
Θ
JA
T
TDC
= T
J
– P x
Θ
J-TDC
where T
A
is the still-air ambient temperature and T
TDC
is the temperature measured by a thermocouple at the top
dead center of the package.
Maximum Junction Temperature (T
J
) in 100-Pin BQFP............................................................................ 100
°
C
100-pin BQFP Maximum Thermal Resistance in Still-Air-Ambient (
Θ
JA
)................................................55
°
C/W
100-pin BQFP Maximum Thermal Resistance, Junction to Top Dead Center (
Θ
J-TDC
)..........................12
°
C/W
Maximum Junction Temperature (T
J
) in 100-Pin TQFP............................................................................ 100
°
C
100-pin TQFP Maximum Thermal Resistance in Still-Air-Ambient (
Θ
JA
) ................................................64
°
C/W
100-pin TQFP Maximum Thermal Resistance, Junction to Top Dead Center (
Θ
J-TDC
)............................6
°
C/W
Maximum Junction Temperature (T
J
) in 144-Pin PBGA............................................................................ 100
°
C
144-pin PBGA Maximum Thermal Resistance in Still-Air-Ambient (
Θ
JA
).....................TBD (estimated 30
°
C/W)
144-pin PBGA Maximum Thermal Resistance, Junction to Top Dead Center (
Θ
J-TDC
)................................TBD
WARNING:
Due to package thermal constraints, proper precautions in the user's application should be
taken to avoid exceeding the maximum junction temperature of 100
°
C. Otherwise, the device
will be affected adversely.
The applications' maximum power, the package type, and the maximum ambient temperature determine the maxi-
mum activity factors for the error correction coprocessor as well as for the DSP core and its peripherals. The follow-
ing equations describe the relationship between these parameters. If the applications' maximum power is less than
the worst-case value, this relationship permits higher activity factors. For these calculations, refer to Section 4.13,
Power Management and Section 9.1, Power Dissipation.
P = MIPS x [AF
ECCP
(P
ECCP
/MIPS) + AF
DSP
(P
DSP
/MIPS) + (1 – AF
DSP
) (P
SLEEP
/MIPS)]
P x
Θ
JA
+ 85
°
C <= 125
°
C
where:
P
MIPS
AF
ECCP
AF
DSP
AF
SLEEP
P
ECCP
P
DSP
P
SLEEP
= Maximum power in mW
= Device speed (internal clock speed
÷
10
6)
= Activity factor for error correction coprocessor (ECCP)
= Activity factor for DSP core and peripherals
= Activity factor for sleep mode operation = 1 – AF
DSP
= Power dissipation in mW for ECCP
= Power dissipation in mW for DSP core and peripherals
= Power dissipation in mW for sleep mode operation
For example, for a TQFP device operating at 50 MIPS in a 3 V application with 40% ECCP activity, 100% DSP ac-
tivity, and 0% sleep activity, the equation would look like this:
50 MIPS x [0.4 (35 mW/50 MIPS) + 1.0(125 mW/50 MIPS) + 0] = 139 mW
139 mW x 64
°
C/W + 85
°
C = 94
°
C <= 100
°
C
The above example demonstrates the maximum operating capability in the TQFP package.
Note:
The power calculations listed are for internal power dissipation only. The external power dissipation due to
output pins switching must also be included.
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