參數(shù)資料
型號: S29GL128N10TAIV13
廠商: SPANSION LLC
元件分類: PROM
英文描述: 3.0 Volt-only Page Mode Flash Memory featuring 110 nm MirrorBit⑩ Process Technology
中文描述: 8M X 16 FLASH 3V PROM, 100 ns, PDSO56
封裝: MO-142BEC, TSOP-56
文件頁數(shù): 100/100頁
文件大小: 952K
代理商: S29GL128N10TAIV13
98
S29GL-N MirrorBit Flash Family
S29GL-N_00_B3 October 13, 2006
D a t a S h e e t
Volatile Sector Protection Command Set
Modified fourth paragraph.
Sector Protection Commands ( x16) table
Changed read command address for Lock Register Bits
Memory Array Commands ( x8)
Added Program and Unlock Bypass Mode commands to table.
W rite Operation Status
Deleted note (second paragraph).
DC Characteristics table
Modified test conditions for I
CC4
.
Revision B1 (May 5, 2006)
Ordering I nformation
Modified speed option, package material set, temperature range descriptions in breakout di-
agram. Modified Note 1.
Advance I nformation on S29GL-P AC Characteristics Hardw are Reset ( RESET# )
Replaced contents in section.
Revision B2 (October 3, 2006)
Connection Diagrams
Corrected 56-pin TSOP package drawing.
Revision B3 (October 13, 2006)
W rite Buffer Programming
Deleted reference to incremental bit programming in last paragraph of section.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary
industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that
includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control,
medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and
artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-men-
tioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures
by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other
abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion
TM
product under development
by Spansion Inc. Spansion Inc. reserves the right to change or discontinue work on any product without notice. The information in this document is provided
as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement
of third-party rights, or any other warranty, express, implied, or statutory. Spansion Inc. assumes no liability for any damages of any kind arising out of the
use of the information in this document.
Copyright 2003–2006 Spansion Inc. All rights reserved. Spansion
TM
, the Spansion logo, MirrorBit, ORNAND, HD-SIM, and combinations thereof, are trade-
marks of Spansion Inc. Other company and product names used in this publication are for identification purposes only and may be trademarks of their re-
spective companies.
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