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參數(shù)資料
| 型號(hào)： | pentium II processor |
| 廠商： | Intel Corp. |
| 英文描述： | 32 bit processor AT 233MHZ，266MHZ，300MHZ and 333MHZ(工作頻率233，266，300和333兆赫茲32位處理器) |
| 中文描述： | 32位處理器，233MHZ，266MHz的的300MHz和333MHz的（工作頻率23326.63萬(wàn)和333兆赫茲32位處理器） |
| 文件頁(yè)數(shù)： | 81/94頁(yè) |
| 文件大?。?/td> | 892K |
| 代理商： | PENTIUM II PROCESSOR |
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E
PENTIUM II PROCESSOR AT 233 MHZ, 266 MHZ, 300 MHZ, AND 333 MHZ
81
1.439
1.449
r = 4.75 inches
Fan power connector location
(1.56 inches above motherboard)
Motherboard fan power header should be
positioned within 4.75 inches of fan power
connector (lateral distance)
Slot 1 Connector
000913
Figure 49. Recommended Motherboard Power Header Placement Relative
to Fan Power Connector and Slot 1
6.4.
Thermal Specifications
This section describes the cooling requirements of
the fan/heatsink solution utilized by the Boxed
processor.
6.4.1.
BOXED PROCESSOR COOLING
REQUIREMENTS
The Boxed processor will be cooled with a
fan/heatsink. The Boxed processor fan/heatsink will
keep the thermal plate temperature, T
PLATE
, within
the specifications (see Table 20), provided airflow
through the fan/heatsink is unimpeded and the air
temperature entering the fan is below 45 °C (see
Figure 43 for measurement location).
Airspace is required around the fan to ensure that the
airflow through the fan/heatsink is not blocked.
Blocking the airflow to the fan/heatsink reduces the
cooling efficiency and decreases fan life. Figure 44
illustrates an acceptable airspace clearance for the
fan/heatsink.
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