參數(shù)資料
型號(hào)： pentium II processor
廠商： Intel Corp.
英文描述： 32 bit processor AT 233MHZ，266MHZ，300MHZ and 333MHZ(工作頻率233，266，300和333兆赫茲32位處理器)
中文描述： 32位處理器，233MHZ，266MHz的的300MHz和333MHz的（工作頻率23326.63萬(wàn)和333兆赫茲32位處理器）
文件頁(yè)數(shù)： 42/94頁(yè)
文件大?。?/td> 892K
代理商： PENTIUM II PROCESSOR
PENTIUM II PROCESSOR AT 233 MHZ, 266 MHZ, 300 MHZ, AND 333 MHZ
E
42
4.0.
THERMAL SPECIFICATIONS
AND DESIGN
CONSIDERATIONS
The Pentium II processor has a thermal plate for
heatsink attachment. The thermal plate interface is
intended to provide for multiple types of thermal
solutions. This chapter will provide the necessary
data for a thermal solution to be developed. See
Figure 18 for thermal plate location.
4.1.
Thermal Specifications
Table 20 provides the thermal design power
dissipation for the Pentium II processor. While the
processor core dissipates the majority of the thermal
power, the thermal power dissipated by the L2 cache
also impacts the thermal plate power specification
and the overall processor power specification.
Systems should design for the highest possible
thermal power, even if a processor with a lower
thermal dissipation is planned. The thermal plate is
the attach location for all thermal solutions. The
maximum allowed thermal plate temperature is
specified in Table 6. A thermal solution should be
designed to ensure the temperature of the thermal
plate never exceeds these specifications.
The processor power is a result of heat dissipated
through the thermal plate and other paths. The heat
dissipation is a combination of heat from both the
processor core and L2 cache. The overall system
thermal design must comprehend the processor
power. The combination of the processor core and
the L2 cache dissipating heat through the thermal
plate is the thermal plate power. The heatsink should
be designed to dissipate the thermal plate power.
See Table 20 for Pentium II processor thermal design
specifications.
Skirt
Left Latch
Right Latch
Cover
Thermal Plate
000921
Figure 18. Processor S.E.C. Cartridge Thermal Plate
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