E
PENTIUM II PROCESSOR AT 233 MHZ, 266 MHZ, 300 MHZ, AND 333 MHZ
3
CONTENTS
PAGE
PAGE
1.0. INTRODUCTION...............................................7
1.1. Terminology....................................................8
1.1.1. S.E.C. CARTRIDGE TERMINOLOGY...8
1.2. References.....................................................8
2.0. ELECTRICAL SPECIFICATIONS ....................9
2.1. The Pentium II Processor System Bus and
VREF.............................................................9
2.2. Clock Control and Low Power States............9
2.2.1. NORMAL STATE — STATE 1..............10
2.2.2. AUTO HALT POWER DOWN STATE —
STATE 2...............................................10
2.2.3. STOP-GRANT STATE — STATE 3.....11
2.2.4. HALT/GRANT SNOOP STATE —
STATE 4...............................................11
2.2.5. SLEEP STATE — STATE 5 .................11
2.2.6. DEEP SLEEP STATE — STATE 6 ......12
2.2.7. CLOCK CONTROL AND LOW POWER
MODES.................................................12
2.3. Power and Ground Pins...............................12
2.4. Decoupling Guidelines.................................12
2.4.1. SYSTEM BUS GTL+ DECOUPLING ...13
2.5. Pentium II Processor System Bus Clock
and Processor Clocking...............................13
2.5.1. MIXING PROCESSORS OF
DIFFERENT FREQUENCIES..............16
2.6. Voltage Identification....................................16
2.7. Pentium II Processor System Bus Unused
Pins..............................................................18
2.8. Pentium II Processor System Bus Signal
Groups.........................................................18
2.8.1. ASYNCHRONOUS VS.
SYNCHRONOUS FOR SYSTEM BUS
SIGNALS..............................................20
2.9. Test Access Port (TAP) Connection............20
2.10. Maximum Ratings ......................................20
2.11. Processor DC Specifications.....................20
2.12. GTL+ System Bus Specifications..............26
2.13. Pentium II Processor System Bus AC
Specifications...............................................26
3.0. SYSTEM BUS SIGNAL SIMULATIONS.........37
3.1. System Bus Clock (BCLK) Signal Quality
Specifications...............................................37
3.2. GTL+ Signal Quality Specifications..............39
3.3. Non-GTL+ Signal Quality Specifications......39
3.3.1. OVERSHOOT/UNDERSHOOT
GUIDELINES........................................39
3.3.2. RINGBACK SPECIFICATION..............41
3.3.3. SETTLING LIMIT GUIDELINE..............41
4.0. THERMAL SPECIFICATIONS AND DESIGN
CONSIDERATIONS........................................42
4.1. Thermal Specifications.................................42
4.2. Pentium II Processor Thermal Analysis...43
4.2.1. THERMAL SOLUTION
PERFORMANCE..................................43
4.2.2. MEASUREMENTS FOR THERMAL
SPECIFICATIONS................................44
4.2.2.1. Thermal Plate Temperature
Measurement.................................44
4.2.2.2. Cover Temperature Measurement.45
4.3. Thermal Solution Attach Methods................45
4.3.1. HEATSINK CLIP ATTACH ...................45
4.3.2. RIVSCREW* ATTACH..........................47
5.0. S.E.C. CARTRIDGE MECHANICAL
SPECIFICATIONS ..........................................51
5.1. S.E.C. Cartridge Materials Information ........51
5.2. Processor Edge Finger Signal Listing..........63
6.0. BOXED PROCESSOR SPECIFICATIONS....73
6.1. Introduction...................................................73
6.2. Mechanical Specifications............................74
6.2.1. BOXED PROCESSOR FAN/HEATSINK
DIMENSIONS.......................................74
6.2.2. BOXED PROCESSOR
FAN/HEATSINK WEIGHT....................76
6.2.3. BOXED PROCESSOR RETENTION
MECHANISM AND FAN/HEATSINK
SUPPORT ............................................76
6.3. Boxed Processor Requirements..................79
6.3.1. FAN/HEATSINK POWER SUPPLY......79