參數(shù)資料
型號(hào): pentium II processor
廠商: Intel Corp.
英文描述: 32 bit processor AT 233MHZ,266MHZ,300MHZ and 333MHZ(工作頻率233,266,300和333兆赫茲32位處理器)
中文描述: 32位處理器,233MHZ,266MHz的的300MHz和333MHz的(工作頻率23326.63萬(wàn)和333兆赫茲32位處理器)
文件頁(yè)數(shù): 3/94頁(yè)
文件大?。?/td> 892K
代理商: PENTIUM II PROCESSOR
E
PENTIUM II PROCESSOR AT 233 MHZ, 266 MHZ, 300 MHZ, AND 333 MHZ
3
CONTENTS
PAGE
PAGE
1.0. INTRODUCTION...............................................7
1.1. Terminology....................................................8
1.1.1. S.E.C. CARTRIDGE TERMINOLOGY...8
1.2. References.....................................................8
2.0. ELECTRICAL SPECIFICATIONS ....................9
2.1. The Pentium II Processor System Bus and
VREF.............................................................9
2.2. Clock Control and Low Power States............9
2.2.1. NORMAL STATE — STATE 1..............10
2.2.2. AUTO HALT POWER DOWN STATE —
STATE 2...............................................10
2.2.3. STOP-GRANT STATE — STATE 3.....11
2.2.4. HALT/GRANT SNOOP STATE —
STATE 4...............................................11
2.2.5. SLEEP STATE — STATE 5 .................11
2.2.6. DEEP SLEEP STATE — STATE 6 ......12
2.2.7. CLOCK CONTROL AND LOW POWER
MODES.................................................12
2.3. Power and Ground Pins...............................12
2.4. Decoupling Guidelines.................................12
2.4.1. SYSTEM BUS GTL+ DECOUPLING ...13
2.5. Pentium II Processor System Bus Clock
and Processor Clocking...............................13
2.5.1. MIXING PROCESSORS OF
DIFFERENT FREQUENCIES..............16
2.6. Voltage Identification....................................16
2.7. Pentium II Processor System Bus Unused
Pins..............................................................18
2.8. Pentium II Processor System Bus Signal
Groups.........................................................18
2.8.1. ASYNCHRONOUS VS.
SYNCHRONOUS FOR SYSTEM BUS
SIGNALS..............................................20
2.9. Test Access Port (TAP) Connection............20
2.10. Maximum Ratings ......................................20
2.11. Processor DC Specifications.....................20
2.12. GTL+ System Bus Specifications..............26
2.13. Pentium II Processor System Bus AC
Specifications...............................................26
3.0. SYSTEM BUS SIGNAL SIMULATIONS.........37
3.1. System Bus Clock (BCLK) Signal Quality
Specifications...............................................37
3.2. GTL+ Signal Quality Specifications..............39
3.3. Non-GTL+ Signal Quality Specifications......39
3.3.1. OVERSHOOT/UNDERSHOOT
GUIDELINES........................................39
3.3.2. RINGBACK SPECIFICATION..............41
3.3.3. SETTLING LIMIT GUIDELINE..............41
4.0. THERMAL SPECIFICATIONS AND DESIGN
CONSIDERATIONS........................................42
4.1. Thermal Specifications.................................42
4.2. Pentium II Processor Thermal Analysis...43
4.2.1. THERMAL SOLUTION
PERFORMANCE..................................43
4.2.2. MEASUREMENTS FOR THERMAL
SPECIFICATIONS................................44
4.2.2.1. Thermal Plate Temperature
Measurement.................................44
4.2.2.2. Cover Temperature Measurement.45
4.3. Thermal Solution Attach Methods................45
4.3.1. HEATSINK CLIP ATTACH ...................45
4.3.2. RIVSCREW* ATTACH..........................47
5.0. S.E.C. CARTRIDGE MECHANICAL
SPECIFICATIONS ..........................................51
5.1. S.E.C. Cartridge Materials Information ........51
5.2. Processor Edge Finger Signal Listing..........63
6.0. BOXED PROCESSOR SPECIFICATIONS....73
6.1. Introduction...................................................73
6.2. Mechanical Specifications............................74
6.2.1. BOXED PROCESSOR FAN/HEATSINK
DIMENSIONS.......................................74
6.2.2. BOXED PROCESSOR
FAN/HEATSINK WEIGHT....................76
6.2.3. BOXED PROCESSOR RETENTION
MECHANISM AND FAN/HEATSINK
SUPPORT ............................................76
6.3. Boxed Processor Requirements..................79
6.3.1. FAN/HEATSINK POWER SUPPLY......79
相關(guān)PDF資料
PDF描述
pentium II xeon processor pentium II xeon processor at 400 and 450 MHZ(工作頻率400和450兆赫茲奔II處理器)
Pentium III cpu with mobile Pentium III processor Mobile Module Connector 2 (MMC-2)(帶移動(dòng)模塊連接器2奔III處理器)
pentium III CPU Pentium III Processor for the SC242 at 450MHz to 1.0GHz(SC242工作頻率450MHZ到1GHZ奔III處理器)
pentium III processor 32 bit Processor Mobile Module(32 位帶移動(dòng)模塊處理器)
Pentium OverDrive Processor Pentium OverDrive Processor With MMX Technology For Pentium Processor-Based System(帶MMX技術(shù)奔騰超速轉(zhuǎn)動(dòng)處理器)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
P-ENV568K3G3 制造商:Panasonic Industrial Company 功能描述:TUNER
PEO14012 制造商:TE Connectivity 功能描述:RELAY SPCO 12VDC
PEO14024 制造商:TE Connectivity 功能描述:RELAY SPCO 24VDC
PEO96742 制造商:Delphi Corporation 功能描述:ASM TERM
PEOODO3A 制造商:MACOM 制造商全稱:Tyco Electronics 功能描述:Versatile Power Entry Module with Small Footprint