參數(shù)資料
型號(hào)： pentium II processor
廠商： Intel Corp.
英文描述： 32 bit processor AT 233MHZ，266MHZ，300MHZ and 333MHZ(工作頻率233，266，300和333兆赫茲32位處理器)
中文描述： 32位處理器，233MHZ，266MHz的的300MHz和333MHz的（工作頻率23326.63萬和333兆赫茲32位處理器）
文件頁(yè)數(shù)： 8/94頁(yè)
文件大?。?/td> 892K
代理商： PENTIUM II PROCESSOR
PENTIUM II PROCESSOR AT 233 MHZ, 266 MHZ, 300 MHZ, AND 333 MHZ
E
8
1.1.
Terminology
In this document, a ‘#’ symbol after a signal name
refers to an active low signal. This means that a
signal is in the active state (based on the name of the
signal) when driven to a low level. For example,
when FLUSH# is low, a flush has been requested.
When NMI is high, a nonmaskable interrupt has
occurred. In the case of signals where the name
does not imply an active state but describes part of a
binary sequence (such as
address
or
data
), the ‘#’
symbol implies that the signal is inverted. For
example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and
D#[3:0] = ‘LHLH’ also refers to a hex ‘A’ (H= High
logic level, L= Low logic level).
The term “System Bus” refers to the interface
between the processor, system core logic (a.k.a. the
PCIset components) and other bus agents. The
System Bus is a multiprocessing interface to
processors, memory and I/O. The term “Cache Bus”
refers to the interface between the processor and the
L2 cache components (TagRAM and BSRAMs). The
Cache Bus does NOT connect to the System Bus,
and is not visible to other agents on the System Bus.
1.1.1.
S.E.C. CARTRIDGE TERMINOLOGY
The following terms are used often in this document
and are explained here for clarification:
Pentium
II processor
— The entire product
including internal components, substrate, thermal
plate and cover.
S.E.C. cartridge
— The new processor packaging
technology is called a “Single Edge Contact
cartridge.”
Processor substrate
—The structure on which the
components are mounted inside the S.E.C.
cartridge (with or without components attached).
Processor core
— The processor’s execution
engine.
Thermal plate
— The surface used to connect a
heatsink or other thermal solutions to the
processor.
Cover
— The processor casing on the opposite side
of the thermal plate.
Latch Arms
— A processor feature that can be
utilized as a means for securing the processor in
the retention mechanism.
Additional terms referred to in this and other related
documentation:
Slot 1
— The connector that the S.E.C. cartridge
plugs into, just as the Pentium
Pro processor
uses Socket 8.
Retention mechanism
— An enabled mechanical
piece which holds the package in the Slot 1
connector.
Heatsink support
— The support pieces that are
mounted on the motherboard to provide added
support for heatsinks.
The L2 cache (TagRAM, BSRAM) dies keep
standard industry names.
1.2.
References
The reader of this specification should also be
familiar with material and concepts presented in the
following documents:
AP-485, Intel Processor Identification With the
CPUID Instruction(Order Number 241618)
AP-585, Pentium
II Processor GTL+ Guidelines
(Order Number 243330)
AP-586, Pentium
II Processor Thermal Design
Guidelines(Order Number 243333)
AP-587, Pentium
II Processor Power Distribution
Guidelines(Order Number 243332)
AP-588, Mechanical and Assembly Technology for
S.E.C. Cartridge Processors (Order Number
243333)
AP-589, Pentium
II Processor Electro-Magnetic
Interference(Order Number 243334)
Pentium
II Processor Specification Update(Order
Number 243337)
Pentium
II Processor I/O Buffer Models, IBIS
Format (Electronic Form)
Pentium
II Processor Developer’s Manual(Order
Number 243341)
Intel Architecture Software Developer’s Manual
Volume I: Basic Architecture(Order Number
243190)
Volume II: Instruction Set Reference(Order
Number 243191)
Volume III: System Programming Guide(Order
Number 243192)
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