參數(shù)資料
型號： pentium II processor
廠商： Intel Corp.
英文描述： 32 bit processor AT 233MHZ，266MHZ，300MHZ and 333MHZ(工作頻率233，266，300和333兆赫茲32位處理器)
中文描述： 32位處理器，233MHZ，266MHz的的300MHz和333MHz的（工作頻率23326.63萬和333兆赫茲32位處理器）
文件頁數(shù)： 76/94頁
文件大?。?/td> 892K
代理商： PENTIUM II PROCESSOR
PENTIUM II PROCESSOR AT 233 MHZ, 266 MHZ, 300 MHZ, AND 333 MHZ
E
76
6.2.2.
BOXED PROCESSOR FAN/HEATSINK
WEIGHT
The Boxed processor fan/heatsink will not weigh
more than 225 grames. See Section 4.0 and Section
5.0 for details on the processor weight and heatsink
requirements.
6.2.3.
BOXED PROCESSOR RETENTION
MECHANISM AND FAN/HEATSINK
SUPPORT
The Boxed processor requires a processor retention
mechanism as described in AP-588, Mechanical and
Assembly
Technology
Processors (Order Number 243333) to secure the
processor in Slot 1. The Boxed processor will not
ship with a retention mechanism. Motherboards
designed for use by system integrators should
include a retention mechanism and appropriate
installation instructions.
for
S.E.C.
Cartridge
The Boxed processor will ship with its own fan
heatsink support. The support differs from supports
for passive heatsinks. The Boxed processor
fan/heatsink support requires heatsink support holes
in the motherboard. Location and size of these holes
are give in Figure 45.
Any motherboard components placed in the area
beneath the fan/heatsink supports must recognize
the clearance (H) give in Table 28 below. Component
height restrictions for passive heatsink support
designs, as described in AP-588, Mechanical and
Assembly
Technology
Processors(Order Number 243333), still apply.
for
S.E.C.
Cartridge
Motherboards
integrators should not have objects installed in the
heatsink
support
holes.
instructions for objects pre-installed in the heatsink
support holes should be included in the motherboard
documentation.
designed
for
use
by
system
Otherwise,
removal
Table 28. Boxed Processor Fan/Heatsink Support Dimensions
1, 2
Fig. Ref.
Label
Dimensions (Inches)
Min
Typ
Max
G
Fan/Heatsink support height
2.261
H
Fan/Heatsink support clearance above motherboard
0.430
J
Fan/Heatsink support standoff diameter
0.275
0.300
K
Fan/Heatsink support front edge to heatsink support hole
center
0.240
L
Fan/Heatsink support standoff protrusion beneath
motherboard
0.06
M
Motherboard thickness
0.05
0.06
0.075
N
Spacing between fan/heatsink support posts
4.084
P
Fan/Heatsink support width
0.600
Q
Fan/Heatsink support inner edge to heatsink support hole
0.400
NOTES:
1.
2.
This table applies to the dimensions noted in Figure 45 through Figure 47.
All dimensions are in inches. Unless otherwise specified, all x.xxx dimension tolerance is ±0.005 inches. All x.xx dimension
tolerance is ±0.01 inches.
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