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參數(shù)資料
| 型號： | Pentium II 266 |
| 廠商： | Intel Corp. |
| 英文描述： | 32-Bit Processor With Low-Power Module(帶低能量模塊的32位處理器) |
| 中文描述： | 32位處理器低功率模塊（帶低能量模塊的32位處理器） |
| 文件頁數(shù)： | 48/50頁 |
| 文件大?。?/td> | 1003K |
| 代理商： | PENTIUM II 266 |
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Pentium
II Processor – Low-Power Module
48
Datasheet
When attaching the mating block to the module TTP, material such as a thermal elastomer or
thermal grease should be used. This material is designed to reduce the thermal resistance and
should be placed between the TTP and the OEM mating block. This will improve the overall
system thermal efficiency.
After the OEM has placed the mating thermal transfer plate, it should be secured with 2.0 mm
screws using a maximum torque of 1.5 - 2.0 Kg*cm (equivalent to 0.147 - 0.197 N*m). The thread
length of the 2.00 mm screws should be 2.25 mm gaugeable thread (2.25 mm minimum to 2.80 mm
maximum).
The board edge clearance includes a 0.762 mm (0.030 in) width EMI containment ring around the
perimeter of the module. This ring is on each layer of the module PCB and is grounded. On the
surface of the module, the metal is exposed for EMI shielding purposes. The hole patterns placed
on the module also have a plated surrounding ring and one can use a metal standoff to contact the
ring for EMI shielding purposes. Figure 16 shows the dimensions of the EMI containment ring and
the keepout area. No components are placed on the board in the keepout area.
Standoffs should be used to provide support for the installed module. The distance from the bottom
of the module PCB to the top of the OEM system electronics board with the connectors mated is
4.0 mm +0.16 mm / -0.13 mm, however the warpage of the baseboard can vary and should be
calculated into the final dimensions of the standoffs used.
5.3.1.1
Module Weight
The weight of the module is 48 g +/- 2 g.
Figure 16. Standoff Holes, Board Edge Clearance and EMI Containment Ring
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