參數(shù)資料
型號: Pentium II 266
廠商: Intel Corp.
英文描述: 32-Bit Processor With Low-Power Module(帶低能量模塊的32位處理器)
中文描述: 32位處理器低功率模塊(帶低能量模塊的32位處理器)
文件頁數(shù): 45/50頁
文件大小: 1003K
代理商: PENTIUM II 266
Pentium
II Processor – Low-Power Module
Datasheet
45
5.1.3
Printed Circuit Board Thickness
Figure 12 shows the module profile and the associated minimum and maximum thickness of the
printed circuit board (PCB). The range of PCB thickness allows for different PCB technologies to
be used with current and future modules.
Note:
The system manufacturer must ensure that the mechanical restraining method and/or system-level
EMI contacts are able to support this range of PCB thickness, to ensure compatibility with future
modules.
5.1.4
Height Restrictions
Figure 13 shows the module mechanical stackup and associated component clearance
requirements.
The system manufacturer establishes the board-to-board clearance between the module and the
system electronics by selecting one of three possible mating connectors.
The mating connectors provide board-to-board clearances (distance underneath the module) of
4 mm, 6 mm or 8 mm. With these three options, the system manufacturer has reasonable flexibility
in choosing components on the system electronics that are between the two boards. The connector
receptacles are available from Berg Electronics (part number 74219-002).
Note:
The module top side component clearance is referenced from the bottom of the PCB, so it is
independent of the PCB thickness.
Figure 13. Module Mechanical Drawing
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