參數(shù)資料
型號: Pentium II 266
廠商: Intel Corp.
英文描述: 32-Bit Processor With Low-Power Module(帶低能量模塊的32位處理器)
中文描述: 32位處理器低功率模塊(帶低能量模塊的32位處理器)
文件頁數(shù): 46/50頁
文件大?。?/td> 1003K
代理商: PENTIUM II 266
Pentium
II Processor – Low-Power Module
46
Datasheet
5.2
Thermal Transfer Plate
The module provides a thermal transfer plate, or TTP, connected to the processor in a standard
position called the thermal attach point (see Figure 14 and Figure 15 for exact dimensions). The
thermal attach point is a fixed location relative to the mounting holes and other physical datum on
the module. The system manufacturer can use both a heat pipe and a heat spreader plate in contact
with the thermal attach point to transfer heat through the system or a thermal solution of their
choice. The TTP thermal resistance as measured between the processor core to the top of the TTP
is less than 1° C per Watt.
The thermal transfer plate is physically mounted to the module, and may be different from one
generation of module to the next. The following figures detail the mechanical dimensions of the
thermal transfer plate used on the module, and the conceptual relationship between the circuit
board thermal transfer plate, and thermal attach point.
Figure 14. Thermal Transfer Plate
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