參數(shù)資料
型號(hào)： Pentium II 266
廠商： Intel Corp.
英文描述： 32-Bit Processor With Low-Power Module(帶低能量模塊的32位處理器)
中文描述： 32位處理器低功率模塊（帶低能量模塊的32位處理器）
文件頁(yè)數(shù)： 4/50頁(yè)
文件大?。?/td> 1003K
代理商： PENTIUM II 266
Pentium
II Processor – Low-Power Module
4
Datasheet
4.8.2
4.8.3
4.8.4
Normal State ..........................................................................................39
Auto Halt State.......................................................................................39
Stop Grant State ....................................................................................40
4.8.4.1 Quick Start State.......................................................................40
HALT/GRANT Snoop State....................................................................41
Sleep State.............................................................................................41
Deep Sleep State...................................................................................41
Currently Supported Clock States..........................................................42
Operating System Implications of the Quick Start and Sleep States .....42
Typical POS/STR Power.....................................................................................42
Mechanical Requirements
....................................................................................43
5.1
Module Dimensions.............................................................................................43
5.1.1
Board Area.............................................................................................43
5.1.2
Module Pin 1 Location............................................................................44
5.1.3
Printed Circuit Board Thickness.............................................................45
5.1.4
Height Restrictions.................................................................................45
5.2
Thermal Transfer Plate .......................................................................................46
5.3
Module Physical Support ....................................................................................47
5.3.1
Module Mounting Requirements ............................................................47
5.3.1.1 Module Weight ..........................................................................48
Thermal Specifications
..........................................................................................49
Labeling Information
...............................................................................................49
7.1
Product Tracking Code .......................................................................................49
7.1.1
Module Identification Bits .......................................................................50
Environmental Standards
.....................................................................................50
4.8.5
4.8.6
4.8.7
4.8.8
4.8.9
4.9
5.0
6.0
7.0
8.0
Figures
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Block Diagram of the Pentium II Processor – Low-Power Module........................9
400-Pin Connector Footprint Pad Numbers, Module Secondary Side................22
BCLK, TCK, PICCLK Generic Clock Waveform at the Processor Core Pins......28
Power On Sequence Timing ...............................................................................31
Instantaneous In-Rush Current Model ................................................................33
Instantaneous In-Rush Current...........................................................................33
Over Current Protection Circuit...........................................................................34
Spice Simulation Using In Rush Protection.........................................................35
Pentium
II
Processor – Low Power Clock Control States.................................38
Low-Power Module Board Dimensions...............................................................43
Low-Power Module Board Dimensions— Connector Pin 1 Orientation.............44
PCB Board Thickness.........................................................................................44
Module Mechanical Drawing...............................................................................45
Thermal Transfer Plate .......................................................................................46
Thermal Transfer Plate .......................................................................................47
Standoff Holes, Board Edge Clearance and EMI Containment Ring..................48
Module Product Tracking Information .................................................................49
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