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| 型號： | Pentium II 266 |
| 廠商： | Intel Corp. |
| 英文描述： | 32-Bit Processor With Low-Power Module(帶低能量模塊的32位處理器) |
| 中文描述： | 32位處理器低功率模塊（帶低能量模塊的32位處理器） |
| 文件頁數(shù)： | 47/50頁 |
| 文件大小： | 1003K |
| 代理商： | PENTIUM II 266 |
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Pentium
II Processor – Low-Power Module
Datasheet
47
5.3
Module Physical Support
Figure 16 shows the module standoff support hole patterns and the board edge clearance around the
perimeter of the module. These hole locations and board edge clearances will remain fixed for all
modules. The hole patterns and board edge clearance lets the system manufacturer develop several
methods for mechanically supporting the module within a system.
5.3.1
Module Mounting Requirements
Three mounting holes are available to the System OEM for securing the module to the system base
or the system electronics. See Figure 10 for mounting hole locations. It is strongly recommended
that the designer use mounting screws through all three of the mounting holes to ensure long term
reliability of the mechanical and EMI integrity of the system.
To interface to the module’s thermal transfer plate (TTP), it is recommended that the exact
dimensions shown in Figure 14 for the OEM thermal interface block be used. These dimensions
provide maximum contact area to the TTP while ensuring that no warpage of the TTP occurs. If
warpage occurs due to the use of an improperly-designed interface, or over-tightening of assembly
screws, the thermal resistance of the module could be adversely affected.
Figure 15. Thermal Transfer Plate
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