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參數(shù)資料
| 型號： | BX80530C1400512 |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1400 MHz, MICROPROCESSOR, CPGA370 |
| 封裝： | FLIP CHIP, PGA-370 |
| 文件頁數(shù)： | 77/94頁 |
| 文件大?。?/td> | 1775K |
| 代理商： | BX80530C1400512 |
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Datasheet
71
Intel Pentium III Processor with 512KB L2 Cache at 1.13GHz to 1.40GHz
6.1
Mechanical Specifications
6.1.1
Mechanical Specifications for the FC-PGA2 Package
This section documents the mechanical specifications of the boxed Intel Pentium III processor
with 512KB L2 Cache fan heatsink in the FC-PGA2 Package. The boxed processor in the FC-
PGA2 Package ships with an un-attached fan heatsink. Figure 28 shows a conceptual
representation of the boxed Intel Pentium III processor with 512KB L2 Cache for the PGA370
socket in the Flip Chip Pin Grid Array 2 (FC-PGA2) package.
The boxed processor fan heatsink is also asymmetrical in that the mechanical step feature, Figure
31, must sit over the socket’s cam. The step allows the heatsink to securely interface with the
processor in order to meet the processor’s thermal requirements.
The dimensions for the boxed processor with the integrated fan heatsink are shown in Figure 30.
All dimensions are in inches.
The Intel Pentium III processor with 512KB L2 Cache uses a new technology termed FC-
PGA2. The FC-PGA2 package leverages the previous FC-PGA package technology used on legacy
Pentium III processors. The FC-PGA2 package adds an Integrated Heat Spreader (IHS) to
improve heat conduction from the processor die. This new solution prevent the need for exotic
thermal solutions in the higher power density processors. See section 5.0 of this document for the
mechanical specifications of the PGA370 socket.
Section 5.2 of this document also shows the recommended mechanical keepout zones for the boxed
dimensions for the boxed processor thermal solution. The cooling fin orientation on the heatsink
relative to the PGA370 socket is subject to change. Contact your local Intel Sales Representative
for documentation specific to the boxed fan heatsink orientation relative to the PGA370 socket.
Figure 31 shows the changes to the package mechanicals between the FC-PGA and FC-PGA2
designs. Note that the boxed fan heatsinks and associated clips are not compatible with earlier
boxed Intel Pentium III processor fan heatsinks.
Figure 29. Comparison between FC-PGA and FC-PGA2 package
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| BX80530F1100256 | 制造商:Intel 功能描述:CELERON PROCESSOR - Boxed Product (Development Kits) |
| BX80530F1200256 | 制造商:Intel 功能描述:MPU CELERON PROCESSOR 64-BIT 0.13UM 1.2GHZ 370-PIN FCPGA2 - Boxed Product (Development Kits) |
| BX80530F1300256 | 制造商:Intel 功能描述:MPU CELERON PROCESSOR 64-BIT 0.13UM 1.3GHZ 370-PIN FCPGA2 - Boxed Product (Development Kits) |
| BX80530F1400256 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Microprocessor |
| BX80531NK170G | 制造商:Intel 功能描述:MPU PENTIUM 4 PROCESSOR NETBURST 64-BIT 0.18UM 1.7GHZ - Boxed Product (Development Kits) 制造商:Intel 功能描述:P4 Socket 478 1.7GHz with fan |
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