參數(shù)資料
型號(hào)： BX80530C1400512
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 1400 MHz, MICROPROCESSOR, CPGA370
封裝： FLIP CHIP, PGA-370
文件頁數(shù)： 52/94頁
文件大?。?/td> 1775K
代理商： BX80530C1400512
48
Datasheet
Intel Pentium III Processor with 512KB L2 Cache at 1.13GHz to 1.40GHz
NOTE: Once Vcc and Vtt supplies are turned off the THERMTRIP# signal will be deactivated. System logic
should ensure no “unsafe” power cycling occurs due to this deassertion.
4.1.2
Thermal Diode
The Intel Pentium III processor with 512KB L2 Cache incorporates an on-die diode that may be
used to monitor the die temperature (junction temperature). A thermal sensor located on the
motherboard, or a stand-alone measurement kit, may monitor the die temperature of the processor
for thermal management or instrumentation purposes. Table 29 and Table 30 provide the diode
parameter and interface specifications.
The Intel Pentium III processor with 512KB L2 Cache uses an Integrated Heat Spreader (IHS)
and has a case temperature requirement. Please see the Intel Pentium III Processors in the FC-
PGA2 Package Thermal Design Guide document for details on measuring the case temperature.
The thermal diode should be used for system thermal management and not determining spec
compliance.
NOTES:
1. Intel does not support or recommend operation of the thermal diode under reverse bias.
2. Characterized at 75
° C with a forward bias current of 5 - 150 A.
3. Characterized at 75
° C with a forward bias current of 5 - 300 A.
4. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode
equation:
Ifw=Is(e^ ((Vd*q)/(nkT)) - 1), where Is = saturation current, q = electronic charge, Vd = voltage across the
diode, k = Boltzmann Constant, and T = absolute temperature (Kelvin).
5. Not 100% tested. Specified by design characterization.
4.2
Thermal Metrology
The thermal metrology for the Intel Pentium III processor in the FC-PGA2 package should be
followed to evaluate the thermal performance of proposed cooling solutions. The thermal
metrology is contained in the Intel Pentium III Processors in the FC-PGA2 Package Thermal
Design Guide.
Table 29. Thermal Diode Parameters1
Symbol
Parameter
Min
Typ
Max
Unit
Notes
Ifw
Forward Bias Current
5
N/A
150
A
1
n
Diode Ideality Factor
1.001452
1.007152
1.012852
2, 4, 5
Ifw
Forward Bias Current
5
N/A
300
A
1
n
Diode Ideality Factor
1.000807
1.009528
1.018249
3, 4, 5
Table 30. Thermal Diode Interface
Pin Name
PGA370 Socket pin #
Pin Description
THERMDP
AL31
diode anode (p_junction)
THERMDN
AL29
diode cathode (n_junction)
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