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參數(shù)資料
| 型號(hào)： | TSB81BA3I |
| 廠商： | Texas Instruments, Inc. |
| 英文描述： | IEEE 1394b THREE-PORT CABLE TRANSCEIVER/ARBITER |
| 中文描述： | 的IEEE 1394b三端口電纜收發(fā)器/仲裁者 |
| 文件頁數(shù)： | 24/57頁 |
| 文件大?。?/td> | 810K |
| 代理商： | TSB81BA3I |
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SLLS559B DECEMBER 2002 REVISED OCTOBER 2003
24
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
APPLICATION INFORMATION
designing with PowerPAD
The TSB81BA3 is housed in a high performance, thermally enhanced, 80-terminal PFP PowerPAD
package.
Use of the PowerPAD package does not require any special considerations except to note that the PowerPAD,
which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor.
Therefore, if not implementing PowerPAD PCB features, the use of solder masks (or other assembly
techniques) may be required to prevent any inadvertent shorting by the exposed PowerPAD of connection
etches or vias under the package. The recommended option, however, is to not run any etches or signal vias
under the device, but to have only a grounded thermal land as explained below. Although the actual size of the
exposed die pad may vary, the maximum size required for the keepout area for the 80-terminal PFP PowerPAD
package is 10 mm
×
10 mm. The actual PowerPAD size for the TSB81BA3 is 6 mm
×
6 mm.
It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the
PowerPAD package. The thermal land varies in size, depending on the PowerPAD package being used, the
PCB construction, and the amount of heat that needs to be removed. In addition, the thermal land may or may
not contain numerous thermal vias depending on PCB construction.
Other requirements for thermal lands and thermal vias are detailed in the TI application note
PowerPAD
Thermally Enhanced Package Application Report
, (SLMA002), available via the TI Web pages at URL:
http://www.ti.com.
Figure 9. Example of a Thermal Land for the TSB81BA3 PHY
For the TSB81BA3, this thermal land must be grounded to the low impedance ground plane of the device. This
improves not only thermal performance but also the electrical grounding of the device. It is also recommended
that the device ground terminal landing pads be connected directly to the grounded thermal land. The land size
must be as large as possible without shorting device signal terminals. The thermal land may be soldered to the
exposed PowerPAD using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is
recommended that the thermal land be connected to the low impedance ground plane for the device. More
information may be obtained from the TI application note
PHY Layout
, (SLLA020).
PowerPAD is a trademark of Texas Instruments.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TSB81BA3IPFP | 功能描述:射頻收發(fā)器 s800 3-Port Cable Xcvr/Arbiter RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| TSB81BA3IPFPEP | 功能描述:射頻收發(fā)器 Mil Enh 3-Port Cable Xcvr/Arbiter RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| TSB81BA3PFP | 功能描述:射頻收發(fā)器 s800 3-Port Cable Xcvr/Arbiter RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| TSB81BA3PFPG4 | 功能描述:射頻收發(fā)器 s800 3-Port Cable Xcvr/Arbiter RoHS:否 制造商:Atmel 頻率范圍:2322 MHz to 2527 MHz 最大數(shù)據(jù)速率:2000 Kbps 調(diào)制格式:OQPSK 輸出功率:4 dBm 類型: 工作電源電壓:1.8 V to 3.6 V 最大工作溫度:+ 85 C 接口類型:SPI 封裝 / 箱體:QFN-32 封裝:Tray |
| TSB82AA2 | 制造商:TI 制造商全稱:Texas Instruments 功能描述:1394b OHCI-LYNX CONTROLLER |
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