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參數(shù)資料
| 型號： | M34559G6FP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 4-BIT, MROM, 6 MHz, MICROCONTROLLER, PQFP52 |
| 封裝： | 10 X 10 MM, 0.65 MM PITCH, PLASTIC, LQFP-52 |
| 文件頁數(shù)： | 35/93頁 |
| 文件大?。?/td> | 1810K |
| 代理商： | M34559G6FP |
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CBTU4411_3
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 12 October 2009
16 of 20
NXP Semiconductors
CBTU4411
11-bit DDR2 SDRAM MUX/bus switch with 12
ON resistance
15.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 15) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 11 and 12
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 15.
Table 11.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 12.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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| M34571GDFP | 4-BIT, MROM, 6 MHz, MICROCONTROLLER, PDSO24 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| M34559G6-XXXFP | 制造商:RENESAS 制造商全稱:Renesas Technology Corp 功能描述:SINGLE-CHIP 4-BIT CMOS MICROCOMPUTER |
| M3455AG8FP | 制造商:RENESAS 制造商全稱:Renesas Technology Corp 功能描述:SINGLE-CHIP 4-BIT CMOS MICROCOMPUTER |
| M3455AG8-XXXFP | 制造商:RENESAS 制造商全稱:Renesas Technology Corp 功能描述:SINGLE-CHIP 4-BIT CMOS MICROCOMPUTER |
| M3455AGCFP | 制造商:RENESAS 制造商全稱:Renesas Technology Corp 功能描述:SINGLE-CHIP 4-BIT CMOS MICROCOMPUTER |
| M3455AGC-XXXFP | 制造商:RENESAS 制造商全稱:Renesas Technology Corp 功能描述:SINGLE-CHIP 4-BIT CMOS MICROCOMPUTER |
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