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參數(shù)資料
| 型號： | Intel Celeron Processor |
| 廠商： | Intel Corp. |
| 英文描述： | Intel Celeron Processor Mobile Module MMC-2 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動(dòng)模塊和連接器2處理器) |
| 中文描述： | 英特爾賽揚(yáng)處理器的移動(dòng)模塊絲裂霉素在400兆赫，366兆赫，333兆赫和300兆赫2（工作頻率400366333300和266兆赫茲帶移動(dòng)模塊和連接器2處理器） |
| 文件頁數(shù)： | 44/47頁 |
| 文件大小： | 414K |
| 代理商： | INTEL CELERON PROCESSOR |
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Intel
a
Celeron
Processor Mobile Module MMC-2
at 400 MHz, 366 MHz, 333 MHz, and 300 MHz
44
Figure 15. Thermal Transfer Plate (B)
5.3
Module Physical Support
5.3.1
Module Mounting Requirements
Three mounting holes are available for securing the module
to the system base. See Figure 9 for mounting hole
locations. These hole locations and board edge clearances
will remain fixed for all Intel mobile modules. All three
mounting holes should be used to ensure long term
mechanical reliability and EMI integrity of the system. The
board edge clearance includes a 0.762-millimeter (0.030
inches) wide EMI containment ring around the perimeter of
the module. This ring is on each layer of the module PCB
and is grounded. On the surface of the module, the metal is
exposed for EMI shielding purposes. The hole patterns also
have a plated surrounding ring to use a metal standoff for
EMI shielding purposes.
Standoffs should be used to provide support for the installed
module. The distance from the bottom of the module PCB to
the top of the system electronics board with the connectors
mated is 4.0 millimeters + 0.16 millimeters / -0.13
millimeters. However, the warpage of the baseboard can
vary and should be calculated into the final dimensions of
the standoffs used. All calculations can be made with the
Intel
a
MMC-2 Standoff/Receptacle Height Spreadsheet.
Information on this spreadsheet can be obtained from your
local Intel representative.
Figure 16 shows the standoff support hole patterns, the
board edge clearance, and the dimensions of the EMI
containment ring. No components are placed on the board in
the keep-out area.
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