參數(shù)資料
型號(hào): Intel Celeron Processor
廠商: Intel Corp.
英文描述: Intel Celeron Processor Mobile Module MMC-2 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動(dòng)模塊和連接器2處理器)
中文描述: 英特爾賽揚(yáng)處理器的移動(dòng)模塊絲裂霉素在400兆赫,366兆赫,333兆赫和300兆赫2(工作頻率400366333300和266兆赫茲帶移動(dòng)模塊和連接器2處理器)
文件頁數(shù): 41/47頁
文件大?。?/td> 414K
代理商: INTEL CELERON PROCESSOR
Intel
a
Celeron
Processor Mobile Module MMC-2
at 400 MHz, 366 MHz, 333 MHz, and 300 MHz
41
5.1.2
Pin 1 Location of the MMC-2 Connector
Figure 11 shows the location of pin 1 of the 400-pin
connector as referenced to the adjacent mounting hole.
Figure 11. Board Dimensions with 400-Pin Connector- Pin 1 Orientation
5.1.3
Printed Circuit Board Thickness
Figure 12 shows the minimum and maximum thickness of
the printed circuit board (PCB). The range of PCB thickness
allows for different PCB technologies to be used with current
and future Intel mobile modules.
Note:
The system manufacturer must ensure that the
mechanical restraining method and/or system-level EMI
contacts are able to support this range of PCB for
compatibility with future Intel mobile modules.
min: 0.90 mm
max: 1.10 mm
Printed circuit board
Figure 12. Printed Circuit Board Thickness
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