參數(shù)資料
型號(hào)： Intel Celeron Processor
廠商： Intel Corp.
英文描述： Intel Celeron Processor Mobile Module MMC-2 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動(dòng)模塊和連接器2處理器)
中文描述： 英特爾賽揚(yáng)處理器的移動(dòng)模塊絲裂霉素在400兆赫，366兆赫，333兆赫和300兆赫2（工作頻率400366333300和266兆赫茲帶移動(dòng)模塊和連接器2處理器）
文件頁(yè)數(shù)： 4/47頁(yè)
文件大?。?/td> 414K
代理商： INTEL CELERON PROCESSOR
Intel
a
Celeron
Processor Mobile Module MMC-2
at 400 MHz, 366 MHz, 333 MHz, and 300 MHz
4
FIGURES
Figure 1. Block Diagram of the Celeron Processor
Mobile Module MMC-2...........................................6
Figure 2. 400-Pin Connector Footprint Pad Numbers.........21
Figure 3. Clock Control States ............................................24
Figure 4. BCLK, TCK, and PICCLK Generic Clock Waveform
at the Processor Core Pins...................................29
Figure 5. Power-on Sequence Timing.................................32
Figure 6. Instantaneous In-rush Current Model...................34
Figure 7. Instantaneous In-rush Current.............................35
Figure 8. Overcurrent Protection Circuit..............................36
Figure 9. Spice Simulation Using In-rush Protection
(Example ONLY))................................................37
Figure 10. Board Dimensions with 400-Pin Connector
Orientation.........................................................40
Figure 11. Board Dimensions with 400-Pin Connector- Pin 1
Orientation.........................................................41
Figure 12. Printed Circuit Board Thickness.........................41
Figure 13. Keep-out Zone...................................................42
Figure 14. Thermal Transfer Plate (A) ................................43
Figure 15. Thermal Transfer Plate (B) ................................44
Figure 16. Standoff Holes, Board Edge Clearance, and EMI
Containment Ring..............................................45
Figure 17. Product Tracking Information.............................46
TABLES
Table 1. Connector Signal Summary....................................7
Table 2. Memory Signal Descriptions ...................................9
Table 3. AGP Signal Descriptions.......................................10
Table 4. PCI Signal Descriptions........................................11
Table 5. Geyserville Descriptions .......................................12
Table 6. Processor/PIIX4E/M Sideband Signal
Descriptions..........................................................13
Table 7. Power Management Signal Descriptions ..............14
Table 8. Clock Signal Descriptions .....................................15
Table 9. Voltage Descriptions .............................................16
Table 10. ITP/JTAG Pins ....................................................17
Table 11. Miscellaneous Pins .............................................17
Table 12. Connector Pin Assignments................................18
Table 13. Connector Specifications ....................................22
Table 14. Configuration Straps for the 82433BX Host Bridge
System Controller...............................................23
Table 15. Clock State Characteristics.................................26
Table 16. POS/STR Power.................................................26
Table 17. Power Supply Design Specifications...................27
Table 18. AC Specifications at the Processor Core Pins ....28
Table 19. BCLK Signal Quality Specifications at the
Processor Core...................................................29
Table 20. Typical Voltage Regulator Efficiency...................30
Table 21. Voltage Signal Definitions and Sequences .........31
Table 22. VR_ON In-rush Current......................................32
Table 23. Capacitance Requirement per Power Plane........33
Table 24. Thermal Sensor SMBus Address Table..............39
Table 25. Thermal Sensor Configuration Register..............39
Table 26. Thermal Design Power Specification..................45
Table 27. Environmental Standards....................................47
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