參數(shù)資料
型號： Intel Celeron Processor
廠商： Intel Corp.
英文描述： Intel Celeron Processor Mobile Module MMC-2 at 400 MHz, 366 MHz, 333 MHz, and 300 MHz(工作頻率400,366,333,300和266兆赫茲帶移動模塊和連接器2處理器)
中文描述： 英特爾賽揚處理器的移動模塊絲裂霉素在400兆赫，366兆赫，333兆赫和300兆赫2（工作頻率400366333300和266兆赫茲帶移動模塊和連接器2處理器）
文件頁數(shù)： 3/47頁
文件大小： 414K
代理商： INTEL CELERON PROCESSOR
Intel
a
Celeron
Processor Mobile Module MMC-2
at 400 MHz, 366 MHz, 333 MHz, and 300 MHz
3
CONTENTS
1.0
INTRODUCTION...................................................5
1.1 Revision History....................................................5
ARCHITECTURE OVERVIEW ..............................5
CONNECTOR INTERFACE..................................7
3.1 Signal Definitions...................................................7
3.1.1
Signal List...................................................8
3.1.2
Memory (109 Signals).................................9
3.1.3
AGP (60 Signals)......................................10
3.1.4
PCI (58 Signals)........................................11
3.1.5
Geyserville (4 Signals)..............................12
3.1.6
Processor/PIIX4E/M Sideband (8 Signals)13
3.1.7
Power Management (7 Signals)................14
3.1.8
Clock (9 Signals).......................................15
3.1.9
Voltages (54 Signals)................................16
3.1.10
ITP/JTAG (9 Signals)................................17
3.1.11
Miscellaneous (82 Signals).......................17
3.2 Connector Pin Assignments..................................18
3.3 Pin and Pad Assignments .....................................21
FUNCTIONAL DESCRIPTION..............................22
4.1 Celeron Processor Mobile Module MMC-2............22
4.2 L2 Cache...............................................................22
4.3 The 82433BX Host Bridge System Controller.......22
4.3.1
Memory Organization...............................22
4.3.2
Reset Strap Options .................................23
4.3.3
PCI Interface.............................................23
4.3.4
AGP Interface...........................................23
4.4 Power Management..............................................23
4.4.1
Clock Control Architecture........................23
4.4.2
Normal State.............................................25
4.4.3
Auto Halt State..........................................25
4.4.4
Stop Grant State.......................................25
4.4.5
Quick Start State.......................................25
4.4.6
HALT/Grant Snoop State..........................25
4.4.7
Sleep State...............................................25
4.4.8
Deep Sleep State......................................26
4.5 Typical POS/STR Power.......................................26
2.0
3.0
4.0
4.6 Electrical Requirements ........................................27
4.6.1
DC Requirements .....................................27
4.6.2
AC Requirements......................................28
4.6.2.1
PSB Clock Signal Quality Specifications
and Measurement Guidelines .............29
4.7 Voltage Regulator..................................................29
4.7.1
Voltage Regulator Efficiency.....................29
4.7.2
Control of the Voltage Regulator...............30
4.7.2.1
Voltage Signal Definition and
Sequencing.........................................31
4.7.3
Power Planes: Bulk Capacitance
Requirements...........................................................32
4.7.4
Surge Current Guidelines .........................34
4.7.4.1
Slew-rate Control: Circuit Description.36
4.7.4.2
Undervoltage Lockout: Circuit
Description (V_uv_lockout).................37
4.7.4.3
Overvoltage Lockout: Circuit Description
(V_ov_lockout)....................................37
4.7.4.4
Overcurrent Protection: Circuit
Description..........................................38
4.8 Active Thermal Feedback......................................39
4.9 Thermal Sensor Configuration Register................39
MECHANICAL SPECIFICATION...........................39
5.1 Module Dimensions...............................................39
5.1.2
Pin 1 Location of the MMC-2 Connector...41
5.1.3
Printed Circuit Board Thickness................41
5.1.4
Height Restrictions ...................................42
5.2 Thermal Transfer Plate..........................................42
5.3 Module Physical Support......................................44
5.3.1
Module Mounting Requirements ...............44
5.3.2
Module Weight..........................................45
THERMAL SPECIFICATION.................................45
6.1 Thermal Design Power.........................................45
6.2 Thermal Sensor Setpoint.......................................45
LABELING INFORMATION...................................46
ENVIRONMENTAL STANDARDS.........................47
5.0
6.0
7.0
8.0
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